Casio Selects Cadence C-to-Silicon Compiler for High-Level Synthesis 2009-06-08 04:52:00 EDA & Design Tools
Lattice Announces New Automotive Qualified Chip Scale 132 BGA Packaging for the LatticeXP2 Family 2009-06-08 02:50:00 SoC Architecture & Assembly
DeFacTo Demonstrates to TESSOLVE the Effectiveness of its RTL Testability Sign-off Solution 2009-06-05 16:15:00 EDA & Design Tools
HelloSoft Announces WiMAX/WiFi Handset Based on Its HS100 IP Convergence Processor 2009-06-05 10:08:00 SoC Architecture & Assembly
Intel to Acquire Wind River Systems for Approximately $884 Million 2009-06-04 15:07:00 Strategic Partnerships
Fujitsu Microelectronics Solutions Adopts EVE's ZeBu Emulation Platform to Develop Embedded Software Before Tapeout 2009-06-04 12:46:00 Commercial Deals
Wi-LAN Reports Second Quarter 2009 Financial Results and Declares Dividend 2009-06-04 08:52:00 Financials
Dolphin Integration launches the design of a SoC as an Archipelago for leakage control with the PERK cell Library 2009-06-04 02:28:00 EDA & Design Tools
Altera Eases Development of 40-nm FPGAs with Stratix IV GX FPGA Development Kit 2009-06-03 17:10:00 SoC Architecture & Assembly
Synopsys Announces First DDR3 IP Verified in Silicon at 1600 Megabits per Second 2009-06-03 15:04:00 IP Cores & Design
Developers of control, automation and instrumentation applications can jumpstart designs with TI's new cost-efficient ARM Cortex-M3-based Stellaris MCU kits 2009-06-03 10:44:00 SoC Architecture & Assembly
ARC Launches New Sound-to-Silicon Solution Aimed at the High-Growth Media Phone Market 2009-06-03 07:13:00 SoC Architecture & Assembly