Is the Role of Test Chips Changing at Advanced Foundry Nodes?

By _Cadence - Cadence IP Blog

July 17, 2019

Test chips are becoming more widespread and more complex at advanced process nodes as design teams utilize early silicon to diagnose problems prior to production. But this approach also is spurring questions about whether this approach is viable at 7nm and 5nm, due to the rising cost of prototyping advanced technology, such as mask tooling and wafer costs.

Semiconductor designers have long been making test chips to validate test structures, memory bit cells, larger memory blocks, and precision analog circuits like current mirrors, PLLs, temperature sensors, and high-speed I/Os. This has been done at 90nm, 65nm, 40nm, 32nm, 28nm, etc., so having test chips at 16nm, 7nm, or finer geometries should not be a surprise. Still, as costs rise, there is debate about whether those chips are over-used given advancements in tooling, or whether they should be utilized even more, with more advanced diagnostics built into them.

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