Virtual Silicon introduces Standard Cells at TSMC 130 nm

Up to 20% Area Saving with High Performance

SUNNYVALE Calif. - September 2, 2003 - Virtual Silicon, Inc., a leader in semiconductor intellectual property (SIP), today announced the introduction of a family of standard cell products targeted for the TSMC 130 nm process. In addition to providing the high performance expected in the 130 nm process, Virtual Silicon's standard cells have been shown to provide up to a 20% reduction in area over currently available standard cells.

"Saving our customer's area in their SoC designs brings them definable monetary benefits," said John A. Ford, vice president of marketing for Virtual Silicon.  "Not only does our high density standard cell IP deliver up to a 20% area reduction to the SoC customer, but it also provides a smaller die, that requires less power and reduces the number of transistors, which helps to improve reliability."

Virtual Silicon offers standard cells for the TSMC CL013G and CL013LV process technologies.  The standard cell library comprises over 600 cells and has incorporated many architectural features for improved design for manufacturability.  The standard cells are available for evaluation download on the Virtual Silicon web site located at  www.virtual-silicon.com. 

About Virtual Silicon Technology

Virtual Silicon is a leading supplier of semiconductor intellectual property and process technology to manufacturers and designers of complex systems-on-chip (SoC). Headquartered in Sunnyvale, CA, the company provides process-specific embedded components that serve the wireless, networking, graphics, communication and computing markets. Customers include leading fabless semiconductor companies, integrated semiconductor manufacturers, foundries, and SoC developers who demand leading edge technology for their semiconductor innovations. For more information, call (408) 548-2700 or visit Virtual Silicon online at www.virtual-silicon.com.

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