TSMC plots system super chips
R Colin Johnson, EETimes
5/13/2013 4:04 PM EDT
Taipei, Taiwan -- The world's leading semiconductor foundry, Taiwan Semiconductor Manufacturing Company, (TSMC) recently detailed its plans to dominate the "system super-chip" market in an exclusive EE Times interview with its chief technology officer and vice president of R&D, Jack Sun.
"If anybody pushes Moore's Law to extremes, TSMC will be there too, but that is not all we do," said Sun. "We also have specialized technologies such as embedded flash, high-voltage, power transistors, MEMS and image sensors -- a spectrum of technologies
To read the full article, click here
Related Semiconductor IP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
- 12-bit, 400 MSPS SAR ADC - TSMC 12nm FFC
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- 25MHz to 4.0GHz Fractional-N RC PLL Synthesizer on TSMC 3nm N3P
Related News
- Semidynamics announces All-In-One AI IP for super powerful, next generation AI chips
- Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
- eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
- QuantWare launches Foundry Services for superconducting quantum chips
Latest News
- proteanTecs and Gubo Technologies Collaborate to Deliver Unified Analytics Solution for Advanced Semiconductor Systems
- Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics
- TES Launches its µEngine: Parallel CPU System for Deterministic Real-Time HDL Applications
- PQShield becomes ST Authorized Partner
- sensiBel Licenses Sofics’ Advanced ESD Solutions for their Studio-quality MEMS Microphone Technology