TSMC Gets Ready to Enjoy Apple Booster
Peter Clarke, Electronics360
15 April 2014
Samsung Electronics Co. Ltd. has done nicely out of its foundry contracts to supply Apple-designed application processors for several years. The orders have kickstarted Samsung's foundry business but, as has been speculated for a couple of years, Apple wants to, at least, split its risk by putting manufacturing out to another foundry, or possibly more than one.
The speculation that pure-play foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) was about to get an Apple chip order has gone on so long – two or three years – that it has become easy to forget what a big deal the wafer shipments are likely to be.
To read the full article, click here
Related Semiconductor IP
- USB 2.0 femtoPHY -TSMC N6 18 x1, OTG, North/South (vertical) poly orientation
- USB 2.0 femtoPHY - TSMC N5 12 x1, North/South (vertical) poly orientation
- USB 2.0 femtoPHY - TSMC N3P 1.2V x1, North/South (vertical) poly orientation
- USB 2.0 picoPHY - TSMC 90LPFS33 x1, OTG
- USB 2.0 femtoPHY - TSMC 7FF18 x1, OTG, North/South (vertical) poly orientation
Related News
- Tower Semiconductor and Paragon Communications Jointly Announce Development Completion of XNN-Based Power Amplifier Booster
- Imagination Technologies extends its multi-year licensing agreement with Apple
- Intel to Cut A Deal with Apple for Fab 42?
- How Small Will Apple Inc. Go?
Latest News
- How hardware-assisted verification (HAV) transforms EDA workflows
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology