Former Apple and Broadcom Executive, Dr. Edward H. Frank, Joins eASIC Board of Directors
Former Apple and Broadcom Executive, Dr. Edward H. Frank, Joins eASIC Board of Directors
Santa Clara, CA – November 25, 2013 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced the appointment of Dr. Edward H. Frank to the company’s Board of Directors. Dr. Frank was recently Vice President of Macintosh Hardware Systems Engineering at Apple, Inc. and currently serves on the board of directors for Fusion-io, Inc.
“Ed’s strong and proven history of developing and bringing revolutionary solutions to market makes him an excellent addition to our board of directors”, said Ronnie Vasishta, president and CEO of eASIC. “His expertise in delivering innovative silicon and systems, at companies both large and small, will be invaluable as we continue to provide unique silicon customizations solution to our system customers.”
“Custom silicon is critical for developing innovative solutions”, said Dr. Frank. “But cost, engineering effort, and development time are major issues. eASIC’s proven Single Mask Adaptable ASIC dramatically reduces those impediments, creating unique and significant opportunities for eASIC customers. I am excited to be working with the eASIC team and leveraging my experience and expertise to further accelerate the company’s growth.”
Previously, Dr. Frank was the vice president of research and development at Broadcom, following its acquisition of Epigram, Inc., a company he co-founded. Dr. Frank also co-founded NetPower Inc. and held senior technology leadership positions at Sun Microsystems Inc. He is a named inventor on over 50 patents and is a Life Trustee of Carnegie Mellon University. Dr. Frank holds BSEE and MSEE degrees from Stanford University and a Ph.D. in Computer Science from Carnegie Mellon University.
About eASIC
eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology (NASDAQ:STX) and Evergreen Partners. For more information on eASIC please visit www.easic.com.
Related Semiconductor IP
- Process/Voltage/Temperature Sensor with Self-calibration (Supply voltage 1.2V) - TSMC 3nm N3P
- USB 20Gbps Device Controller
- SM4 Cipher Engine
- Ultra-High-Speed Time-Interleaved 7-bit 64GSPS ADC on 3nm
- Fault Tolerant DDR2/DDR3/DDR4 Memory controller
Related News
- TSMC Board of Directors Meeting Resolutions
- Statement by the board of directors of I.A.R. Systems Group AB in relation to the public offer from The Qt Company Ltd
- QuickLogic Appoints Ron Shelton to Board of Directors
- Cycuity Welcomes Semiconductor Industry Veteran Bill Reaves to Board of Directors
Latest News
- Cassia Proposes ‘Better Math’ for AI Efficiency
- QuickLogic Announces $1M eFPGA Hard IP Contract for Data Center ASIC
- Creonic Updates Doppler Channel IP Core with Extended Frequency Band and Sampling Range
- TSMC Price Hikes End the Era of Cheap Transistors
- Analogue Insight IP Group Launches Analogue Insight SAFE in Portland, Oregon to Deliver Certification-Grade Security IP for Next-Gen SoCs and Chiplets