Teledyne Acquires Axiom IC
THOUSAND OAKS, Calif. â May 14, 2013 â Teledyne Technologies Incorporated (NYSE:TDY) announced today that its subsidiary, Teledyne DALSA B.V., has acquired Axiom IC B.V., a fabless semiconductor company that develops high-performance CMOS mixed-signal integrated circuits. Terms of the transaction were not disclosed.
Located in Enschede, the Netherlands, Axiom IC was founded in 2007 and is a spin-off from the University of Twente. Axiom ICâs customers include global companies in a number of industries, including space systems, wireless communications, automotive and medical technologies. Axiom has delivered important design breakthroughs including high speed, high resolution analog to digital converters and advanced audio signal processing chips.
âThe acquisition of Axiom adds an innovative team of skilled engineers to Teledyne,â said Robert Mehrabian, chairman, president and chief executive officer of Teledyne. âWhile continuing to serve external customers, Axiom will provide additional resources to benefit both our digital imaging and electronic test & measurement instrumentation businesses.â
âThe Axiom team will further enhance our ability to bring to our customers innovative and highly differentiated CMOS-based image sensor and camera products,â said Brian Doody, chief executive officer of Teledyne DALSA, Inc. âAxiomâs unique mixed-signal design expertise and experience represent a valuable strengthening of our design capabilities across the company, complementing our existing expertise in CMOS image sensor design, high voltage driver chips for MEMS, and embedded software development.â
About Teledyne Technologies
Teledyne Technologies is a leading provider of sophisticated instrumentation, digital imaging products and software, aerospace and defense electronics, and engineered systems. Teledyne Technologiesâ operations are primarily located in the United States, Canada, the United Kingdom and Mexico. For more information, visit Teledyne Technologiesâ website at www.teledyne.com.
About Teledyne DALSA
Teledyne DALSA, a Teledyne Technologies company, is an international leader in high performance digital imaging and semiconductors with approximately 1,000 employees worldwide, headquartered in Waterloo, Ontario, Canada. Established in 1980, the company designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing MEMS products and services. For more information, visit www.teledynedalsa.com.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- New High Performance, Low-Power ADC Designs from Teledyne DALSA's IC Design Group
- Sibridge Technologies & Axiom Design Automation Partner to Integrate Verification IPs with SystemVerilog
- Teledyne Lecroy and IP-Maker to showcase NVM Express functionalities at Flash Memory Summit
- Mentor Graphics and Teledyne LeCroy Collaborate to Deliver New Emulation Verification Platform for SuperSpeed USB Applications
Latest News
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs
- Silicon Creations Celebrates 20 Years of Global Growth and Leadership in 2nm IP Solutions
- TSMC Debuts A13 Technology at 2026 North America Technology Symposium