Subramaniam Hariharan joins eSilicon executive team to head global manufacturing operations
SUNNYVALE, Calif. — March 21, 2013 — eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced the addition of Subramaniam (Hari) Hariharan to its executive team as vice president, global manufacturing operations.
"Hari will lead our global manufacturing and operations (GMO) team to further drive excellence in quality, speed and cost effectiveness to our global customer base," said Jack Harding, eSilicon's president and CEO. "Hari's extensive expertise in manufacturing, operations and supply chain, driving change and successfully deriving business value, make him ideally suited to lead the next evolution of GMO for eSilicon."
Hariharan has over 30 years of experience in operations management and strategic planning at various organizations in Singapore, Canada and the U.S. In his most recent role, he was vice president, global manufacturing operations and quality at Gennum Corporation. Prior to Gennum, he held various senior manufacturing management roles at ST Microelectronics and R&D roles at Indian Telephone Industries, Ltd. Hariharan has a Bachelor of Engineering in Electronics and Communications from University of Kerala, India and a Master of Business from Royal Melbourne Institute of Technology, Australia.
About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.
Related Semiconductor IP
- Flash Memory LDPC Decoder IP Core
- SLM Signal Integrity Monitor
- All Digital Fractional-N RF Frequency Synthesizer PLL in GlobalFoundries 22FDX
- USB 4.0 V2 PHY - 4TX/2RX, TSMC N3P , North/South Poly Orientation
- TSMC CLN5FF GUCIe LP Die-to-Die PHY
Related News
- eSilicon Appoints Jim Lindstrom Chief Financial Officer
- Inapac Technology and eSilicon Partner on SiP Program; eSilicon to Offer Inapac SIPFLOW Memory IP and Methodology to Enable SiP Applications
- New eSilicon Direct Model Lowers Risks and Costs for Custom Chip Developers
- eSilicon Offers Complete 90nm DDR2 Memory Interface Solutions
Latest News
- SEMIFIVE Files for Pre-IPO Review on KRX
- Innosilicon Scales LPDDR5X/5/4X/4 and DDR5/4 Combo IPs to 28nm and 22nm, Cementing Its Position as the ‘One Stop’ for Memory Interface Solutions
- Synopsys Completes Acquisition of Ansys
- Zephyr 4.0 Now Available for SCR RISC-V IP
- Lattice Semiconductor and Missing Link Electronics Become Partners to Accelerate FPGA Design Projects