Subramaniam Hariharan joins eSilicon executive team to head global manufacturing operations
SUNNYVALE, Calif. — March 21, 2013 — eSilicon Corporation, the largest independent semiconductor design and manufacturing services provider, today announced the addition of Subramaniam (Hari) Hariharan to its executive team as vice president, global manufacturing operations.
"Hari will lead our global manufacturing and operations (GMO) team to further drive excellence in quality, speed and cost effectiveness to our global customer base," said Jack Harding, eSilicon's president and CEO. "Hari's extensive expertise in manufacturing, operations and supply chain, driving change and successfully deriving business value, make him ideally suited to lead the next evolution of GMO for eSilicon."
Hariharan has over 30 years of experience in operations management and strategic planning at various organizations in Singapore, Canada and the U.S. In his most recent role, he was vice president, global manufacturing operations and quality at Gennum Corporation. Prior to Gennum, he held various senior manufacturing management roles at ST Microelectronics and R&D roles at Indian Telephone Industries, Ltd. Hariharan has a Bachelor of Engineering in Electronics and Communications from University of Kerala, India and a Master of Business from Royal Melbourne Institute of Technology, Australia.
About eSilicon
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer and industrial segments. www.esilicon.com.
Related Semiconductor IP
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
 - MIPI SoundWire I3S Peripheral IP
 - P1619 / 802.1ae (MACSec) GCM/XTS/CBC-AES Core
 - LPDDR6/5X/5 Controller IP
 - Post-Quantum ML-KEM IP Core
 
Related News
- eSilicon Appoints Jim Lindstrom Chief Financial Officer
 - Inapac Technology and eSilicon Partner on SiP Program; eSilicon to Offer Inapac SIPFLOW Memory IP and Methodology to Enable SiP Applications
 - New eSilicon Direct Model Lowers Risks and Costs for Custom Chip Developers
 - eSilicon Offers Complete 90nm DDR2 Memory Interface Solutions
 
Latest News
- ANAFLASH Advances Embedded FLASH Memory for Next-Generation Smart Edge Devices with Samsung Foundry
 - SEMI Reports Global Silicon Wafer Shipments to Rebound 5.4% in 2025, with New Record Expected by 2028
 - Intel Eyeing AI Catchup in Inference with SambaNova Acquisition
 - ADTechnology Collaborates with Euclyd to Develop Ultra-Efficient AI Chip for Datacenters
 - SEALSQ and IC’Alps Unify Expertise to Deliver Integrated Post-Quantum Cybersecurity and Functional Safety for Autonomous Vehicles