Sidense Gains Market Momentum Looks to Double Number of Engineers
August 14, 2006, Ottawa, ON: Sidense Corporation, a two year old firm specializing in Memory Semiconductor Intellectual Property Cores is on a hiring spree and plans to double the number of engineers on staff at their Canadian design center.
Xerxes Wania, ceo of Sidense wants to increase the engineering team to 25 individuals within the next six months. "Ottawa has a deep pool of engineering talent especially in the semiconductor space so to meet demand it makes sense for us to grow the operation there", he said.
Founded in 2004, Sidense is focused on developing Memory Semiconductor Intellectual Property cores for customers that use the Sidense technology in various electronic devices including flat panel displays, wireless networks, PDAs and cell phones. The company is working on the latest memory designs in 65 and 90 nanometer geometries.
Word about the company's advanced technology has spread quickly in the industry and Sidense is seeing interest and orders from a number of customers and potential customers. It is this customer demand that is driving the firm's hiring spree.
"We haven't promoted the company at all but word is out and we are getting strong interest in our products from a range of customers. Since our engineering team is working on the latest memory designs in 65 and 90 nanometer geometries, this will excite engineers looking to make a change." Mr. Wania said.
About Sidense
Sidense Corp., focuses on developing Non-Volatile Memory (NVM) intellectual property (IP) cores to be embedded onto standard logic digital CMOS Application Specific Integrated Circuits (ASICs) and custom Integrated Circuits (ICs). Sidense's 1T-FuseTM technology is most suitable for feature sizes of 130nm and smaller. Potential applications include electrical fuse, FLASH and MASK programmable ROM replacement, code storage, RFID, Unique ID, encryption, key storage and in Digital Rights Management. They currently have offices in Mississauga and Ottawa, Canada and sales offices in San Francisco, CA and Tokyo, Japan. Visit the website http://www.sidense.com.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- AMBA Interconnect Technology Gains Further Industry Momentum
- LSI Logic Gains Momentum in Korea as Pulsus Deploys Products Using ZSP400
- Interview: Rambus' chairman looks to the future -- Geoff Tate discusses shortage of U.S. engineers, market opportunities and demand from chipmakers
- MIPI Alliance Gains Membership Momentum with Strong Projected Market Deployment of Specifications
Latest News
- Silicon Creations Celebrates 20 Years of Global Growth and Leadership in 2nm IP Solutions
- TSMC Debuts A13 Technology at 2026 North America Technology Symposium
- Cadence Collaborates with TSMC to Accelerate Design of Next-Generation AI Silicon
- Synopsys Partners with TSMC to Power Next-Generation AI Systems with Silicon Proven IP and Certified EDA Flows
- JEDEC® Previews LPDDR6 Roadmap Expanding LPDDR into Data Centers and Processing-in-Memory