Reports: Renesas to tie up with TSMC, cut jobs
Peter Clarke, EETimes
5/24/2012 4:48 AM EDT
Renesas reportedly confirmed it will tie-up with TSMC (Hsinchu, Taiwan) but provided no details. The move to outsource more chip production is seen as a move to combat heavy losses made by the company.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- EnOcean accelerates its growth and breadth of energy-saving solutions through the acquisition of the assets of the edge computing solutions business from Renesas
- GlobalFoundries and Renesas Expand Partnership to Accelerate U.S. Semiconductor Manufacturing
- Rambus and Renesas Electronics Renew License Agreement
- Synopsys' Design Compiler Graphical Adopted by Renesas for Automotive ICs
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs