Rambus Announces Executive Management Changes
Luc Seraphin appointed to GM of Memory and Interfaces Division; Kit Rodgers to serve as SVP of Worldwide Sales and Technology Partnerships
SUNNYVALE, Calif. – November 11, 2015 – Rambus Inc. (NASDAQ:RMBS) today announced the appointment of Luc Seraphin to the role of senior vice president and general manager of its Memory and Interfaces Division. Luc replaces Kevin Donnelly who, after 23 years with Rambus, has decided to retire at the end of the year. Prior to Rambus, Luc served as the general manager of the Mobile Wireless business unit of Agere Systems (now Avago Technologies). Luc holds a bachelor’s degree in Mathematics and Physics and a master’s degree in Electrical Engineering from Ecole Superieure de Chimie, Physique, Electronique, based in Lyon, France where he majored in Computer Architecture. Luc also holds an MBA from the University of Hartford and has completed the senior executive program of Columbia University.
In addition, Kit Rodgers has assumed the role of senior vice president of Worldwide Sales and Technology Partnerships for the company. Kit has been serving as senior vice president of Licensing and Technology Partnerships for Rambus since 2014, and played a key role in structuring some of the company’s biggest customer wins during the last few years. Prior to that, Kit served as one of the leaders of the Rambus Cryptography Research Division, having joined Cryptography Research in 2003 as vice president of Business Development and Licensing. Kit holds a bachelor’s degree and a master’s in engineering from Stanford University, where he was a Mayfield Entrepreneurship Fellow.
“Both Luc and Kit bring tremendous experience and expertise to their respective roles,” said Dr. Ron Black, president and chief executive officer at Rambus. “We are pleased to advance our leadership from within to build strong teams to build and bring our technologies and products to market.”
About Rambus Inc.
Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- CXL 3.0 Controller
- ECC7 Elliptic Curve Processor for Prime NIST Curves
Related News
- Rambus Announces Departure of Ron Black as Chief Executive Officer; Luc Seraphin Appointed Interim CEO
- Rambus Appoints Luc Seraphin as President and Chief Executive Officer
- Rambus Demonstrates CXL Platform Development Kit at SC23
- Imec releases industry's first 14nm process development kit
Latest News
- AIStorm and DB HiTek Debut SpectroMic™ KWS—an 18uA Always-on Keyword-Spotting Solution Enabling IoT AI Voice Interaction
- SignatureIP Unveils Industry-Leading CXL 3.2 Solution for High-Performance Computing
- Synopsys and Ansys Provide Update Regarding Expected Timing of Acquisition Close
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards