Qualcomm to Acquire HQV and FRC Video Processing Assets from IDT
SAN DIEGO and SAN JOSE, Calif., Sept. 7, 2011 -- Integrated Device Technology, Inc. (IDT®; NASDAQ: IDTI) and Qualcomm Incorporated (NASDAQ: QCOM) today announced the signing of a definitive agreement to transfer the design team of IDT's Hollywood Quality Video™ (HQV™) and Frame Rate Conversion (FRC) Video Processing product lines and certain related assets to Qualcomm. In addition, under the terms of the agreement, both companies will explore opportunities to include IDT's broad portfolio of mixed-signal products into Qualcomm reference designs. The all-cash transaction has received appropriate corporate approvals and is anticipated to close in the coming weeks, subject to the completion of certain closing conditions.
"This transaction enables IDT to intensify our focus on our core timing, interface and analog-intensive mixed-signal solutions for growing applications in cloud computing, wireless infrastructure and consumer mobility. In addition, it enables a new working relationship with Qualcomm," said Dr. Ted Tewksbury, president and chief executive officer at Integrated Device Technology. "Working with Qualcomm gives us the opportunity to expand our business in next-generation smart media devices, and puts us in a stronger position to solve complex system-level problems by offering our customers tighter integration and increased performance."
"Hollywood Quality Video is a well-recognized, award-winning technology that provides Qualcomm with a leadership position in the video processing space," said Steve Mollenkopf, executive vice president and group president, Qualcomm. "Media consumption continues to cross device boundaries and create growing expectations for high-quality viewing experiences. When combined with Qualcomm's high-performance Snapdragon processor, integrated HQV technology will raise the quality bar for media consumption on smartphones, tablets and other smart media devices. We look forward to working with IDT in the future."
About IDT
Integrated Device Technology, Inc., the Analog and Digital Company™, develops system-level solutions that optimize its customers' applications. IDT uses its market leadership in timing, serial switching and interfaces, and adds analog and system expertise to provide complete application-optimized, mixed-signal solutions for the communications, computing and consumer segments. Headquartered in San Jose, Calif., IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol "IDTI." Additional information about IDT is accessible at www.IDT.com.
About Qualcomm
Qualcomm Incorporated (NASDAQ: QCOM) is the world leader in 3G and next-generation mobile technologies. For more than 25 years, Qualcomm ideas and inventions have driven the evolution of wireless communications, connecting people more closely to information, entertainment and each other. Today, Qualcomm technologies are powering the convergence of mobile communications and consumer electronics, making wireless devices and services more personal, affordable and accessible to people everywhere. For more information, visit Qualcomm around the Web: www.qualcomm.com
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Accelerate Smart Embedded Vision Designs with Microchip's Expanding Low-Power FPGA Video and Image Processing Solutions
- Foxconn Partners with Socionext and Hailo to Launch Next-Generation AI Processing Solution for Video Analytics at the "Edge"
- Lattice mVision Solution Stack Enables 4K Video Processing at Low Power for Embedded Vision Applications
- CAST Introduces 8K Video Codecs and Advanced Image Signal Processing IP Cores
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs