Qimonda Further Extends Foundry Agreement with Winbond

-- Qimonda AG (NYSE: QI) and Winbond Electronics Corp. today announced that they have signed an agreement to further expand their existing cooperation for the production of memory chips (DRAMs). Under the terms of this agreement, Qimonda will transfer its 75nm and 58nm DRAM trench technology to Winbond’s 300mm facility in Taichung, Taiwan. In return, Winbond will manufacture DRAMs for computing applications in these technologies exclusively for Qimonda. The transfer of the 58nm-technology from Qimonda will enable Winbond also to develop and sell respective proprietary specialty memories for which Qimonda will receive license fees and royalties.

This new agreement is the extension of the two companies’ existing cooperation which encompasses the transfer and licensing of the Qimonda 110nm, 90nm and 80nm DRAM-Trench technologies for Winbond’s production sites.

“The successful cooperation in respect of the 110nm, 90nm and 80nm process technology transfers encouraged us to further expand our foundry and license agreement with Winbond,“ said Thomas Seifert, COO of Qimonda. “The expansion of the cooperation aims to further strengthen our production capabilities and flexibility.“

About Qimonda

Qimonda AG is a leading supplier of DRAM memory products. Following its carve out from Infineon Technologies AG on May 1, 2006, Qimonda went public on the New York Stock Exchange on August 9, 2006. The company generated net sales of €3.81 billion in its 2006 financial year and has approximately 12,000 employees worldwide. Qimonda has access to five 300mm manufacturing sites on three continents and operates five major R&D facilities, including its lead R&D center in Dresden. The company is a leading supplier of DRAM products to PC and server manufacturers and is increasingly using its power saving trench technology for graphics, mobile and consumer applications. Further information is available at www.qimonda.com.

About Winbond

Winbond Electronics Corporation was founded in Hsinchu Science-Based Industrial Park, Taiwan in 1987. Winbond, a leading supplier of semiconductor solutions owns two business groups - Logic IC Business Group and Memory IC Business Group. Logic IC Business Group focuses on two specific sectors including ìc-based consumer ICs, PC logic ICs.

Memory IC Business Group is dedicated in Mobile RAM and low-density Flash memory. It covers major products in low power DRAM, Specialty DRAM, Pseudo SRAM, commodity DRAM, Flash etc. The company with more than 5,000 employees in the worldwide, and there are some subsidiaries in Mainland China, Japan, America and Israel.