MStar Licenses Tensilica IP Core From Cadence
SAN JOSE, CA, Jul 30, 2013 -- Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced that MStar Semiconductor, Inc., a leading semiconductor company for display and digital home solutions, has licensed the Tensilica(R) Xtensa(R) DPU (dataplane processor unit) for a new SOC (system on chip) design for the home entertainment and home networking market segments. MStar utilized the customization capabilities of the Xtensa DPU to add application-specific interfaces and instructions which optimized the Xtensa core for the best performance and lower power.
"By leveraging the capabilities of the Xtensa DPU, we were able to better optimize our design for higher efficiency," stated WK Chia, Vice President of Research and Development, MStar. "As a result, we were able to further enhance our home entertainment platform and provide our customers with more cost-efficient solutions."
"MStar used our Verilog-like DPU customization capability to optimize their Xtensa core," stated Jack Guedj, corporate vice president, SoC Realization Group at Cadence. "This has enabled MStar to achieve significant performance improvement over other standard signal processing cores."
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
Related Semiconductor IP
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
Related News
- Cadence Advances Pervasive Intelligence at the Edge with Next-Generation Extensible Tensilica Processor Platform
- Cadence Expands Tensilica IP Portfolio with New HiFi and Vision DSPs for Pervasive Intelligence and Edge AI Inference
- Cadence Expands Tensilica Vision Family with Radar Accelerator and New DSPs Optimized for Automotive Applications
- Dream Chip and Cadence Demo Automotive SoC Featuring Tensilica AI IP at embedded world 2024
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost