Motorola and WiLAN Settle Litigation
OTTAWA, Canada – January 27, 2011 – Wi-LAN Inc. (“WiLAN” or the “Company”) (TSX:WIN), a leading technology innovation and licensing company, today announced that it has settled all pending patent litigation with Motorola, Inc. On January 4, 2011, Motorola, Inc. split into two companies; Motorola Solutions and Motorola Mobility. As a result of the settlement, both Motorola Solutions and Motorola Mobility have obtained multi-year licenses to WiLAN’s patent portfolio and each will make a series of fixed cash payments to WiLAN. Other terms of the agreement are confidential.Motorola Mobility is the 12th handset vendor to take a license to WiLAN’s portfolio.
The settlement includes the dismissal of all litigations between the companies in the U.S. District Court for the Eastern District of Texas.
About WiLAN
WiLAN, founded in 1992, is a leading technology innovation and licensing company. WiLAN has licensed its intellectual property to over 240 companies worldwide. Inventions in our portfolio have been licensed by companies that manufacture or sell a wide range of communication and consumer electronics products including 3G cellular handsets, Wi-Fi-enabled laptops, Wi-Fi/DSL routers, xDSL infrastructure equipment, WiMAX base stations and digital television receivers. WiLAN has a large and growing portfolio of more than 970 issued or pending patents. For more information: www.wilan.com.
Related Semiconductor IP
- NFC wireless interface supporting ISO14443 A and B with EEPROM on SMIC 180nm
- DDR5 MRDIMM PHY and Controller
- RVA23, Multi-cluster, Hypervisor and Android
- HBM4E PHY and controller
- LZ4/Snappy Data Compressor
Related News
- Wi-LAN Initiates Litigation Against Motorola, RIM and UTStarCom / Company confirms settlement of Marvell Dispute
- Wi-LAN Amends Complaint to Add LG to Litigation Against Motorola, RIM and UTStarCom
- Wi-LAN and Infineon Settle Patent Litigation
- WiLAN and UTStarcom Settle Litigation
Latest News
- CAST Releases First Dual LZ4 and Snappy Lossless Data Compression IP Core
- Arteris Wins “AI Engineering Innovation Award” at the 2025 AI Breakthrough Awards
- SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
- eMemory’s NeoFuse OTP Qualifies on TSMC’s N3P Process, Enabling Secure Memory for Advanced AI and HPC Chips
- AIREV and Tenstorrent Unite to Launch Advanced Agentic AI Stack