MediaTek to Stay with TSMC for Finer-Node Chips
Alan Patterson, EETimes
6/1/2015 10:58 AM EDT
MediaTek will use TSMC’s 16nm FinFET Plus and 10nm process technology for its next-generation chips, according to MediaTek Chief Financial Officer David Ku, speaking to EE Times on the sidelines of the Computex electronics trade show in Taipei.
“TSMC’s support has been excellent,” he said.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- TSMC Certifies Synopsys Design Tools for 16-nm FinFET Plus Production and for 10-nm Early Design Starts
- Cadence Announces DDR4 and LPDDR4 IP Achieve 3200 Mbps on TSMC 16nm FinFET Plus Process
- Synopsys Tools Achieve TSMC Certification for 16-nm FinFET+ Process and Entered 10-nm FinFET Collaboration
- Cadence Unveils Broad IP Portfolio for New TSMC 16nm FinFET Plus Process
Latest News
- ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI