M31 Receives "Customers' Choice Award" from TSMC OIP Forum 2014
Hsinchu, Taiwan -- January 28, 2015 — M31 Technology, a global Intellectual Property (IP) provider announced it has received a “Customers’ Choice Award” for a paper presented at TSMC’s 2014 Open Innovation Platform® Ecosystem (OIP) Forum. The paper is Method of Portable Device Processing Data Based on Clock Extracted from Host Device. The authors are Scott Chang, Danny Huang and Eason Yi.
Built-in Clock (BCK) on high-speed interface IP is a crystal-less solution for IC design projects, especially mobile devices. This method has been widely used in USB related devices, such as flash memory disk, wireless transmitter, external sound card and webcam applications. This technology has the advantages of lower power consumption, great compatibility and the best electrical characteristics while accelerating M31 customers’ time-to-market. M31’s BCK technology has been verified on USB 2.0/3.0 devices and applied on the developing USB 3.1 interface and other device applications with high-speed interfaces.
M31 Technology was also honored with TSMC’s “Emerging IP Provider of the Year Award” in 2013. Suk Lee, the Senior Director of TSMC’s Design Infrastructure Marketing Division, has awarded a trophy to the team including Chairman H.P. Lin and three authors in M31’s company.
ABOUT M31 TECHNOLOGY
M31 Technology is a professional silicon intellectual property (IP) provider. The company was founded July 2011 with headquarters in Hsinchu, Taiwan. Our strength is R&D and customer service. With substantial experience in IP development, IC design and electronic design automation, we focus on providing high-speed interface IP, memory compilers and standard- cell library solutions. For more information please visit www.m31tech.com
Related Semiconductor IP
- xSPI Multiple Bus Memory Controller
- MIPI CSI-2 IP
- PCIe Gen 7 Verification IP
- WIFI 2.4G/5G Low Power Wakeup Radio IP
- Radar IP
Related News
- M31 Technology Wins Customers' Choice Award for Automotive IP Paper at TSMC Open Innovation Platform (OIP) Ecosystem Forum
- eSilicon Takes TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- Open-Silicon Receives TSMC OIP Ecosystem Forum Customers' Choice Award for Best Paper
- Cadence Recognized with TSMC OIP Ecosystem Forum Customers' Choice Award for 3D-IC Design
Latest News
- Premier ASIC and SoC Design Partner, Sondrel, Rebrands as Aion Silicon
- Intel Financial Risks, Layoffs, Foundry Ambitions
- BOS Semiconductors to Partner with Intel to Accelerate Automotive AI Innovation
- China Takes the Lead in RF Front-End Patent Activity: RadRock and Others Surge Behind Murata
- Arteris Wins Two Gold and One Silver Stevie® Awards in the 2025 American Business Awards®