LSI Logic extends leadership in high-speed serial interconnect with two GigaBlaze 0.11-micron multi-gigabit transceiver cores

Multi-gigabit serializer/deserializer cores offer low power, physical layer support and unprecedented flexibility for new interface standards

MILPITAS, Calif., October 14, 2002 – LSI Logic Corporation reinforces its market leadership in multi-gigabit Serializer/Deserializer (SerDes) capability by introducing two low power GigaBlaze® transceiver cores in the company’s Gflx™ 0.11-micron technology. Offered as x1 and x4 hard macros, both cores are designed for high-speed interconnect applications in the storage and computing markets and address the rising demand for reliable, standards-compliant, high-bandwidth connections. These cell-based CMOS cores can be fully integrated and support a wide variety of applications, such as Serial ATA, Serial Attached SCSI (SAS), Fibre Channel, PCI Express, 10-Gigabit Ethernet (XAUI), InfiniBand and proprietary backplane interconnects. 

The LSI Logic GigaBlaze cores provide full-duplex, point-to-point communication channels with serial data rates of up to 4.25Gbps and contain both serializer and deserializer circuitry. The GigaBlaze x4 core (four SerDes in a single hard macro) is ideally suited for applications that require a large number of SerDes on a single chip, such as SAN switches. The GigaBlaze x4 core, multi-lane ports, used in PCI Express and 10-Gigabit Fibre Channel, are easily integrated onto a single chip. The GigaBlaze x1 core (one SerDes in a single hard macro) is optimized for applications that require only one or two SerDes such as Fibre Channel disk drives or host bus adapters. 

“LSI Logic has a solid foundation with five generations of our highly successful GigaBlaze transceiver cores. This foundation allowed us to refine the technology for the utmost performance and ease of use,” said Dave Jones, vice president and general manager of LSI Logic’s Storage and Computing ASICs Division. “Offering two flavors of the GigaBlaze core means our customers have maximum flexibility in addressing the high-speed, low power requirements for today’s ever-increasing bandwidth needs.”

The GigaBlaze cores are also designed to take full advantage of the high performance electrical features of the LSI Logic family of standard packages, providing exceptional signal integrity. This includes utilizing differential package traces for the high speed signaling lines. LSI Logic has a full family of flip chip and wire bond packages. 

The GigaBlaze cores are part of the LSI Logic CoreWare® design program, an extensive library of pre-designed and pre-verified cores that can be easily integrated with customer-designed logic. The CoreWare program reduces development time and overall system cost while increasing system performance and reliability. Customer designs with the LSI Logic GigaBlaze Gflx transceiver cores are already underway. 

More information on LSI Logic GigaBlaze cores and packaging technology can be found at http://www.lsilogic.com/products/coreware/gigablaze/index.html and http://www.lsilogic.com/products/asic/packaging/index.html.

The GigaBlaze Gflx interface core is also available in our recently announced RapidChip semiconductor platform for fast SoC designs. 

About LSI Logic Corporation
LSI Logic Corporation (NYSE: LSI) is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1621 Barber Lane, Milpitas, CA 95035, http://www.lsilogic.com.