Setting the record straight on the Intel-TSMC 3-D 'race'
Dylan McGrath, EETimes
7/11/2011 1:29 AM EDT
Last week, a report by the Taiwan External Trade Development Council (TAITRA), a nonprofit organization promoting trade with Taiwanese firms, did just that, issuing a report that tantalizingly suggested that TSMC might beat Intel to the punch in bringing "three-dimensional chips" to market. EE Times and other news organizations quickly seized on the report and published stories based on it.
The problem, as many EE Times readers promptly pointed out, is that the report was deeply flawed and based upon a false equivalency.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Vulcan ASIC Ltd. rekindles Java core race with Moon IP
- Chartered battles to stay in foundry race
- Actel FPGAs Accelerate Development of Multiple-Application Race Car Engine Control Units
- STMicroelectronics Wins the Race to Deliver First 65-nm CMOS Design Platform
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs