Report: Infineon talks to Intel over sale of wireless unit
Peter Clarke, EETimes
(05/17/2010 9:24 AM EDT)
LONDON — Infineon Technologies AG (Munich, Germany) is in talks with Intel Corp. (Santa Clara, Calif.) over the possible sale of its wireless chip business, according to the Financial Times Deutschland, which cites unnamed sources at Infineon.
Infineon's wireless unit has achieved success supplying 3G communications chips to Apple for the iPhone and iPad and also supplies mobile phone companies including Nokia and Samsung.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
- SHA-256 Secure Hash Algorithm IP Core
Related News
- Altera and BigCat Wireless Partner to Accelerate Deployment of Altera’s Open Radio Unit Reference Designs in Wireless Communications Infrastructure
- Intel ASIC unit to focus on comms chips and is building a network of third-party intellectual-property suppliers to support the effort
- Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
- LSI Logic Licenses Synthesizable ARM926EJ-S Core With a Memory Management Unit and Java Support
Latest News
- TSMC Chases Soaring AI Demand
- EU DARE Project Is Scrambling to Replace Codasip
- Sofics and Alcyon Photonics Partner to Support Next-Generation Photonic Systems
- QuickLogic Appoints Quantum Leap Solutions as Authorized Sales Representative
- Cadence and NVIDIA Expand Partnership to Reinvent Engineering for the Age of AI and Accelerated Computing