Report: Infineon talks to Intel over sale of wireless unit
Peter Clarke, EETimes
(05/17/2010 9:24 AM EDT)
LONDON — Infineon Technologies AG (Munich, Germany) is in talks with Intel Corp. (Santa Clara, Calif.) over the possible sale of its wireless chip business, according to the Financial Times Deutschland, which cites unnamed sources at Infineon.
Infineon's wireless unit has achieved success supplying 3G communications chips to Apple for the iPhone and iPad and also supplies mobile phone companies including Nokia and Samsung.
To read the full article, click here
Related Semiconductor IP
- JPEG XL Encoder
- LPDDR6/5X/5 PHY V2 - Intel 18A-P
- ML-KEM Key Encapsulation & ML-DSA Digital Signature Engine
- MIPI SoundWire I3S Peripheral IP
- ML-DSA Digital Signature Engine
Related News
- Altera and BigCat Wireless Partner to Accelerate Deployment of Altera’s Open Radio Unit Reference Designs in Wireless Communications Infrastructure
- Intel ASIC unit to focus on comms chips and is building a network of third-party intellectual-property suppliers to support the effort
- Philips Semi, Cadence's Tality unit team up in Bluetooth solutions
- LSI Logic Licenses Synthesizable ARM926EJ-S Core With a Memory Management Unit and Java Support
Latest News
- EnSilica to develop quantum-resilient secure processor chip for critical national infrastructure applications backed by £5m UK Government ‘Contract for Innovation’
- CAST Introduces JPEG XL Encoder IP Core for High- Quality, On-Camera Still-Image Compression
- PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys’ Next-Generation Interface and Memory IP on Advanced Nodes
- IntelPro Licenses Ceva Wi-Fi 6 and Bluetooth 5 IPs to Launch AIoT Matter-Ready SoCs
- VeriSilicon and Google Jointly Launch Open-Source Coral NPU IP