Icom License CEVA DSP for Wireless Baseband Applications
CEVA powers digital land mobile products from Icom
MOUNTAIN VIEW, Calif., Feb. 13, 2012 -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Icom, Inc. has licensed CEVA DSP core technology to power its digital wireless communication products. CEVA's powerful and flexible DSP engine, enabled Icom to develop a cost-efficient, programmable wireless baseband solution with ultra-low power consumption for their latest range of land mobile products.
"We chose CEVA's DSP for our wireless communication products, due to their proven track record and industry leadership in baseband DSPs," said a spokesperson at Icom. "The low-power nature of our communication products requires the most power efficient DSP for the task. CEVA's DSP delivers outstanding power efficiency, while maintaining exceptional performance standards."
"The optimal balance of power and performance delivered by our DSP is ideal for Icom's evolving product lines as they enhance wireless baseband functionality," said Eran Briman, vice president of marketing at CEVA. "The addition of Icom to the broad range of customers leveraging our DSPs for wireless baseband applications is further evidence of our dominant industry position in licensable DSPs."
CEVA's industry-leading DSP cores power many of the world's leading wireless semiconductors, enabling unrivalled power consumption, performance and cost efficiencies in wireless solutions. The Company's wireless customer base includes, Broadcom, Intel, Mindspeed, Nufront, Samsung, Spreadtrum, ST-Ericsson, VIA Telecom, Xincomm and now Icom. Including over 15 design wins for LTE, CEVA has more than 35 wireless design wins to date, targeting a wide range of handset, mobile broadband and wireless infrastructure applications. In total, more than 2 billion CEVA-powered wireless handsets have shipped.
About Icom, Incorporated
ICOM Inc. has been a world leader in radio communications for over 40 years. One of a few organizations that manufacture a total radio line-up of Land Mobile, Marine, Amateur, Air Band and Communications Receivers, ICOM's technological prowess is legendary. ICOM continues to lead the industry with the development of digital technologies to provide the future in radio communications to the world. For more information, visit www.icom.co.jp/world.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
Related Semiconductor IP
- HiFi iQ DSP
- 5G IoT DSP
- 5G RAN DSP
- Tensilica ConnX 120 DSP
- 32-bit 8-stage superscalar processor that supports RISC-V specification, including GCNP (DSP)
Related News
- ASR License CEVA DSP and Connectivity Technologies for Smartphones and IoT Devices
- MorningCore Technology License CEVA DSP for High Performance Wireless and Automotive Communication Platforms
- Picocom License CEVA DSP for 5G New Radio Infrastructure SoC
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
Latest News
- GUC Announces Tape-out of UCIe 64G IP on TSMC N3P Technology
- Caspia Launches New RTL Security Analyzer Enabling Agentic Silicon Security Verification
- Europe’s stealth leading-edge process technology
- Combined CapEx of Top Eight CSPs to Exceed $710 Billion in 2026; Google Leads ASIC Deployment with TPUs
- UMC Announces Key Changes in Executive Leadership