Fujitsu Semiconductor Adopts Cadence Chip Planning System for MCU Chips at Its Design Centers Worldwide
Fujitsu Semiconductor Achieves Time-to-Market Boost from Earlier Chip Planning
SAN JOSE, Calif., 08 May 2012 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Fujitsu Semiconductor Limited has adopted the newly updated Cadence Chip Planning System at its nine design centers spread around the globe. Fujitsu Semiconductor chose the Cadence system because of the time, accuracy and cost benefits it offers in the development of its MCU chips requiring large-scale integration (LSI).
âWe continue to expand our use of the Cadence Chip Planning System at Fujitsu Semiconductor for one key reason--it helps us build better chips faster,â said Mutsuaki Kai, vice president of Environmental Technology Development and Products Engineering Division, Fujitsu Semiconductor Limited. âThe latest enhancements to the technology have increased its value to us, and the combination of the technology and the support from Cadence has made this chip planning system a significant factor in our efforts to stay ahead of our competitors.â
The Cadence Chip Planning System enables early and accurate IC estimation, allowing tradeoffs between chip size, power consumption, cost, and time to market. Newly added features include advanced interactive I/O planning and links to board and package design solutions, enabling earlier and more accurate die size and power estimation. The Cadence technology delivers a unified chip planning environment that enables efficient information sharing among global design teams. Leveraging high fidelity models of semiconductor IP and manufacturing processes, the system provides a unified cockpit for technical and economic chip estimation which can be shared by multiple design teams. With the help of Cadence engineers, Fujitsu Semiconductor design teams further customized and tailored the system to take advantage of several of their unique technologies, enabling even more finely tuned chip plans.
âThe Cadence Chip Planning System offers a unique, easy-to-use environment for customers to get the type of information they need to make and implement critical design decisions earlier in the development process,â said Pankaj Mayor, vice president of marketing, Cadence. âBy deploying the system throughout its network of design centers, Fujitsu Semiconductor is helping ensure its engineering teams can work together efficiently to make the best possible decisions for developing LSI devices that are both high quality and profitable.â
Fujitsu Semiconductor now utilizes the Cadence Chip Planning System for its design teams worldwide.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- Transforming Chip Design with Agentic AI: Introducing Cadence Cerebrus AI Studio
- Cadence Unleashes ChipStack AI Super Agent, Pioneering a New Frontier in Chip Design and Verification
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs