FDSOI Gains Design Wins Amid Fab Partner Mystery
Peter Clarke, Electronics360
28 January 2014
European chip company STMicroelectronics NV is gaining design wins for its 28nm fully depleted silicon-on-insulator (FDSOI) manufacturing process but is being coy about who will be its initial partner for high volume manufacturing. The date for the start of second-source volume manufacturing of FDSOI chips also appears to have slipped.
Jean-Marc Chery, executive vice president and general manager of embedded processing solutions at ST, told Electronics 360 that the number of FDSOI IC designs in development has risen to 15. That number stood at three about eight months ago. But he also declined to discuss progress at Globalfoundries in bringing up high volume manufacturing capacity of FDSOI chips.
To read the full article, click here
Related Semiconductor IP
- Multi-channel Ultra Ethernet TSS Transform Engine
- Configurable CPU tailored precisely to your needs
- Ultra high-performance low-power ADC
- HiFi iQ DSP
- CXL 4 Verification IP
Related News
- Silicon Image Reference Design Partnership with MediaTek Gains Additional MHL Smartphone Design Wins
- GF Grabs AI Wins with FD-SOI
- Cadence Wins Four 2023 TSMC OIP Partner of the Year Awards
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
Latest News
- ASICLAND Partners with Daegu Metropolitan City to Advance Demonstration and Commercialization of Korean AI Semiconductors
- SEALSQ and Lattice Collaborate to Deliver Unified TPM-FPGA Architecture for Post-Quantum Security
- SEMIFIVE Partners with Niobium to Develop FHE Accelerator, Driving U.S. Market Expansion
- TASKING Delivers Advanced Worst-Case Timing Coupling Analysis and Mitigation for Multicore Designs
- Efficient Computer Raises $60 Million to Advance Energy-Efficient General-Purpose Processors for AI