eSilicon Tapes Out 7nm neuASIC IP Platform Test Chip
Chip validates latest release of IP to support artificial intelligence ASICs
SAN JOSE, Calif. — May 7, 2019— eSilicon, a leading provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the tapeout of a 7nm test chip to validate the latest neuASIC™ IP platform release. eSilicon’s neuASIC IP platform provides a library of IP that supports a wide range of functions found in artificial intelligence applications. The IP is verified to be compatible and supports algorithm-specific customization as well as a validated integration architecture through eSilicon’s ASIC Chassis.
IP on the test chip includes specialized memory and compute blocks to support near-memory compute applications. These include specialized low power memory for interfacing with multiply-accumulate functions (MACs) as well as large embedded SRAMs supporting multiple ports. The large (GIGA) memory supports WAZPS (word all zero power saving) and various sleep modes for standby power reduction. The compute blocks include several MAC blocks, low power standard cells, transpose memory functions and a convolutional neural network engine. Low-power data movement IP (cross-bar) are also included as well as IP for support functions such as GPIO, PLL and BIST.
“Our neuASIC IP platform has received a very strong reception,” said, Patrick Soheili, vice president, business and corporate development at eSilicon. “Some of the largest consumers of AI technology in the world, as well as many high-profile AI startups have engaged with us to dig deeper into our neuASIC IP platform. This new test chip will provide silicon data to support that process.”
You can learn more about eSilicon’s neuASIC IP platform here, or contact your eSilicon sales representative directly or via sales@esilicon.com.
AbouteSilicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- eSilicon Tapes Out 7nm 400G Gearbox/Retimer Test ASIC
- eSilicon Tapes Out 7nm Combo PHY (HBM2/HBM2E/Low Latency) Test Chip
- Chip Interfaces Successfully Completes Interlaken IP Interoperability Test with Cadence 112G Long-Reach PHY
- eSilicon announces 7nm FinFET ASIC design win
Latest News
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations