Black Sand Announces Acquisition of CMOS PA Intellectual Property
Advances CMOS PA Leadership Through Patent Portfolio Acquisition
AUSTIN, Texas -- February 02, 2010 -- Black Sand Technologies, Inc., a specialist in advanced power amplifier technology for wireless applications, today announced that it previously acquired a patent portfolio related to CMOS power amplifiers (PAs) from Silicon Laboratories.
According to the terms of the transaction, Black Sand received a number of issued and pending patents from Silicon Laboratories. The U.S. and international patents include claims and methods related to power amplifier architectures and implementations that can be used in a CMOS process.
In September, Black Sand announced the world’s first 3G CMOS RF PA. Black Sand’s proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices.
“The acquired IP represents important technology for Black Sand, significantly advancing our position as the leader in this field,” said John Diehl, CEO of Black Sand. “When combined with our internally developed IP, these foundational patents give us a unique combination of outstanding technology and substantial IP.” Detailed terms of the agreement were not disclosed.
Black Sand’s RF PA products are targeted at mobile phones and other 3G wireless devices, such as datacards and netbooks. Mobile phones and wireless products today use power amplifiers based on Gallium Arsenide (GaAs) semiconductor technology. Replacing GaAs with CMOS improves manufacturing yield, performance, cost, battery life, and call quality.
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- Javelin Semiconductor chooses Kilopass Non Volatile Memory Intellectual Property Core for MIPI RFFE Digital Interface in Next-Generation CMOS Power Amplifiers
- Intellectual Property Servicing Centre Opens at Hong Kong Science Park; Establishes IP Servicing Platform for the Semiconductor Industry
- Summit Design Launches Intellectual Property Initiative to Enable Consistent, Pre-Verified, Multi-Vendor Compatible IP
- The TPL Group Names F. Eric Saunders Chief Counsel for Intellectual Property (IP) and Dennis Miller Vice President of IP Development Engineering
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost