CEVA Addresses the Next Trends in Mobile, Digital Home and Automotive at CES 2014 with Range of Platform IP Solutions for SoC Design

Technologies on display include comprehensive solutions for advanced computational photography and embedded vision, Bluetooth and Wi-Fi connectivity, low-power audio offloading and 'always-on' voice activation, all optimized for power, cost and performance

MOUNTAIN VIEW, Calif., Dec. 5, 2013 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will showcase a range of comprehensive platform IP solutions at CES 2014 designed to enable the next technology trends in the mobile, digital home and automotive markets. At the show, taking place in Las Vegas from January 7-10th, CEVA will host a private meeting suite in the Las Vegas Hotel where invitees can interact with the demonstrations and meet with CEVA engineers, partners and members of the executive team.

CEVA's platform IP solutions allow customers to simplify their SoC design effort and significantly reduce both the power consumption and cost of implementing the most advanced technology requirements across a broad range of end markets. These solutions include:

• The industry's most advanced and lowest power computational photography and embedded vision platform IP designed to enable true product differentiation to any camera-enabled device, including all-in-focus imaging, smart zoom, multi-exposure, object recognition, gesture recognition, image stabilization and much more.
• The industry's first universal communications platform IP, addressing LTE, LTE-Advanced, Wi-Fi, satellite communications, DTV demodulation, wired access and much more. The platform is scalable to meet any design requirements, from the Internet of Things (IoT) through smartphones and tablets to Wi-Fi access points and base stations.
• The industry's lowest power platform IP for advanced voice and audio applications, offering extended battery life and enhanced feature sets such as always-listening voice trigger, noise reduction, speaker protection, and high-resolution audio.

To request a meeting with CEVA at CES and view the latest advancements in high-performance DSPs and platform IPs, please email events@ceva-dsp.com or contact your local CEVA sales office.

About CEVA, Inc.

CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA's IP was shipped in over 1.1 billion devices, powering smartphones from many of the world's leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.