CEVA to Showcase Latest DSPs and Platform IPs for Mobile, Digital Home and Automotive at CES 2013
Technologies on display include comprehensive solutions for advanced imaging & vision processing, natural user interface, audio enhancement, voice pre-processing, software-based Wi-Fi 802.11ac, satellite navigation (GNSS) and Bluetooth 4.0 Low Energy
MOUNTAIN VIEW, Calif., Dec. 5, 2012 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it will showcase a range of comprehensive platform IPs targeting the mobile, digital home and automotive markets, including the first silicon-based implementations of Wi-Fi 802.11ac and satellite navigation (GNSS) on the CEVA-XC323 DSP, at CES 2013. At the show, taking place in Las Vegas from January 8-11 th, CEVA will host a private meeting suite in the Las Vegas Hotel (formerly Las Vegas Hilton) where invitees can interact with the demonstrations and meet with CEVA engineering experts and members of the CEVA executive team.
Technologies on display will include:
- Imaging & Vision - CEVA and its partners will demonstrate the latest applications for advanced imaging and vision processing, including advanced touch-free user interface, video stabilization, Dynamic Range Compression (DRC), color enhancement and Advanced Driver Assistance Systems (ADAS) technologies.
- Audio & Voice - CEVA and its partners will demonstrate a comprehensive range of audio and voice applications, including voice pre-processing (echo cancellation, beam forming, noise reduction and more) and audio post-processing (surround virtualization, volume equalization, speaker correction and more).
- Communications & Connectivity - CEVA and its partners will demonstrate software-based Wi-Fi 802.11ac, satellite navigation (GNSS) and Bluetooth 4.0 LE technology.
To request a meeting with CEVA at CES and view the latest advancements in high-performance DSPs and platform IPs, please email events@ceva-dsp.com or contact your local CEVA sales office.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (computer vision, image enhancements and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices and powers handsets from every top handset OEM, including Nokia, Samsung, HTC, LG, Motorola, Sony, Huawei and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
Related Semiconductor IP
- HBM4 PHY IP
- eFuse Controller IP
- Secure Storage Solution for OTP IP
- Ultra-Low-Power LPDDR3/LPDDR2/DDR3L Combo Subsystem
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Flex Logix and CEVA Announce First Working Silicon of a DSP with Embedded FPGA to Allow a Flexible/Changeable ISA
- Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
- Ceva Extends its Connect IP Portfolio with Wi-Fi 7 Platform for High-End Consumer and Industrial IoT
Latest News
- LTSCT and Andes Technology Sign Strategic IP Licensing Master Agreement to accelerate RISC-V Based Advanced Semiconductor Solutions
- Global Semiconductor Sales Increase 29.8% Year-to-Year in November
- BAE Systems Licenses Time Sensitive Networking (TSN) Ethernet IP Cores from CAST
- HBM4 Mass Production Delayed to End of 1Q26 By Spec Upgrades and Nvidia Strategy Adjustments
- ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract