CEVA Introduces Low Power, Multi-Mode LTE-Advanced Reference Architecture for the New CEVA-XC4000 DSP Architecture Framework
Multi-mode design, provides customers complete flexibility to support multiple wireless standards, including LTE-A, LTE, TD-SCDMA, HSPA+, and more
MOUNTAIN VIEW, Calif., February 21, 2012 – CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced a new software-based, multi-mode reference architecture for the development of low power, cost efficient LTE-Advanced (LTE-A) and legacy cellular modems. Based on the new CEVA-XC4000 DSP architecture framework, this powerful, scalable reference architecture leverages innovative power management and system partitioning to enable a software-based LTE-A solution requiring as small as 3.4 sqmm die area and 100mW at a 28nm process. A complete set of optimized LTE-A libraries developed by CEVA is incorporated, significantly accelerating time-to-market and reducing development efforts for customer SoCs.
To allow licensees complete flexibility and scalability for multi-mode wireless system designs, the reference architecture offers sophisticated software-hardware system integration capabilities, allowing for the seamless integration of customer-owned coprocessors and hardware accelerators. This level of flexibility enables the reuse of proprietary IP within the reference architecture. The reference architecture supports the most demanding use cases, including the maximum throughput of LTE-A Rel-10 up to CAT-7. For example, it supports carrier aggregation of up to two carrier components to a total of 40MHz channel bandwidth, with spatial multiplexing of 8x4 MIMO, 300 Mbps downlink and 100 Mbps on the uplink.
Eran Briman, vice president of marketing at CEVA stated, “LTE-Advanced poses enormous technical and power/performance challenges for modem designers, requiring 5X system performance while facing today’s power constraints. Our multi-mode LTE-Advanced reference architecture utilizes our new CEVA-XC4000 DSP reference architecture together with our second generation power scaling unit, and smart, flexible software-hardware partitioning to address these challenges. As a result, our LTE-Advanced reference architecture offers a compelling solution for any modem design, and represents a significant step forward in our wireless product portfolio.”
Together with CEVA-XCnet partner mimoOn GmbH, the CEVA LTE-A reference architecture addresses the entire PHY layer requirements of multiple wireless standards in software, with minimal hardware acceleration. Commenting on today’s LTE-A reference architecture announcement, Dirk Friebel, CEO of mimoOn stated: “CEVA’s new software-based LTE-A reference architecture is another important milestone for the wireless industry, bringing a cost-efficient and low-power solution to the market. Our LTE-A PHY software will serve as an important component in a software-based LTE-A solution, and we are pleased to continue our successful partnership with CEVA and address their next generation architectures.”
Streamlined Software Development
The LTE-Advanced reference architecture is supported by CEVA-Toolbox™, a complete software development environment, incorporating Vec-C™ compiler technology for advanced vector processors, enabling the entire architecture to be programmed in C-level. An integrated simulator provides accurate and efficient verification of the entire system including the memory sub-systems. In addition, CEVA-Toolbox includes libraries, a graphical debugger, and a complete optimization tool chain named CEVA Application Optimizer. The Application Optimizer enables automatic and manual optimization applied in the C source code.
For more information, visit www.ceva-dsp.com/CEVA-XC4000.html.
Availability
The LTE-A reference architecture is available today for lead customers. For more information, contact sales@ceva-dsp.com.
About CEVA, Inc.
CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2011, CEVA's IP was shipped in over 1 billion devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
Related Semiconductor IP
- LTE Turbo Decoder
- LTE Release-9 UE PHY. (L1) IP
- LTE Release-10 Baseband PHY. (L1) IP
- CoreLTEFE: RF Front-End for LTE mid-band application - GlobalFoundries 130nm RFSOI
- LTE Release-10 Baseband Protocol Stack (L2-L3) SW IP
Related News
- CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
- Cadence Announces Tensilica HiFi 3z DSP Architecture for Latest Mobile and Home Entertainment Applications
- CEVA Announces CEVA-BX, a New All-Purpose Hybrid DSP / Controller Architecture for Digital Signal Processing and Digital Signal Control in IoT devices
- Arteris IP and Wave Computing Collaborate on Reference Architecture for Enterprise Dataflow Platform
Latest News
- HPC customer engages Sondrel for high end chip design
- PCI-SIG’s Al Yanes on PCIe 7.0, HPC, and the Future of Interconnects
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- Cadence Unveils Arm-Based System Chiplet
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers