Cadence Launches Next-Generation Tensilica High-Performance ConnX Baseband DSP Family
32- and 64-MAC baseband DSP IP cores offer higher performance at lower power and area for 3G/4G LTE-Advanced, WiFi 80211.ac and HDTV demodulation
SAN JOSE, Calif., February 19, 2014— Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the availability of its next generation Tensilica® ConnX baseband digital signal processor (DSP) intellectual property (IP) cores. New products in the family include the ConnX BBE32EP and BBE64EP, optimized for complex number processing at low power and ideally suited for smartphones and tablets, HDTVs, set-top boxes, and automotive communications infrastructure system applications. These two DSP IP cores excel at efficiently processing algorithms for LTE, LTE-Advanced, 802.11ac, HDTV demodulation, 3G/HSPA+, and WiFi including MIMO processing. For more detailed information on these new baseband DSPs, visit http://ip.cadence.com/ipportfolio/tensilica-ip/comms-dsp
The ConnX BBE32EP and BBE64EP cores both offer significant improvements in maximum frequency and algorithmic performance while reducing both silicon area and power consumption. When compared to earlier generations, the ConnX BBE32EP core provides a 25 percent improvement, and the ConnX BBE64EP core provides an 80 percent improvement in maximum frequency.
In addition, the ConnX BBE32EP and BBE64EP cores provide unprecedented flexibility in system implementations by supporting power consumption levels that significantly reduce the need for hardware accelerators.
For example, the ConnX BBE32EP lowers power consumption by up to 33 percent compared to earlier generation cores, thereby allowing more functions to be implemented in software, while maintaining a comparable power budget.
“Whether it’s a microcell, an access point, a mobile hotspot, a tablet, or a set-top box, all of these designs can benefit from the flexibility of a software-based solution for faster development time, interoperability tuning and tracking standards updates,” said Jack Guedj, corporate vice president of the IP Group at Cadence. “This flexibility can only be achieved at the low power requirement of modems that implement the signal processing on programmable processors like the ConnX BBE32EP and BBE64EP.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today’s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- Sentons Licenses Cadence Tensilica ConnX DSP for a Differentiated Ultrasound-Based Touch Solution
- New Cadence Tensilica ConnX B20 DSP Boosts Performance by Up to 10X for Automotive Radar/Lidar and Up to 30X for 5G Communications
- Cadence Tensilica HiFi DSP Enables Highly Energy-Efficient Audio Playback for Dolby Atmos for Cars
- Fluent.ai Offers Embedded Voice Recognition for Cadence Tensilica HiFi 5 DSP-Based True Wireless Stereo Products
Latest News
- How hardware-assisted verification (HAV) transforms EDA workflows
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology