Cadence and GLOBALFOUNDRIES Announce Broad, Multi-Year Technology Agreement
SAN JOSE, Calif. -- Aug 31, 2009
-- Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, and GLOBALFOUNDRIES Inc., a leading-edge semiconductor manufacturing company, today announced that the two companies have entered into a multi-year software and services agreement for advanced semiconductor design. As part of the agreement, GLOBALFOUNDRIES has adopted a comprehensive suite of Cadence® technologies to aid in the design, verification and manufacturing of complex semiconductor devices targeting process technologies of 45 nanometers and below. In addition, GLOBALFOUNDRIES will team with the Cadence Services organization to build differentiated design-enablement capabilities to support customers at advanced process nodes.
GLOBALFOUNDRIES chose Cadence because of its strong interest in creating a broad, open design flow that enables fast, accurate and easy access to Cadence technology. The foundry has adopted the Cadence Virtuoso® and Encounter® design environments, as well as specialized technologies for diagnostics, IP validation and parasitic extraction, complemented by support services.
âCadence technology and services will be important tools to help ensure that GLOBALFOUNDRIES has the enablement infrastructure necessary to support complex customer designs,â said Mojy Chian, senior vice president of design enablement at GLOBALFOUNDRIES. âOur customers are operating at the leading edge of technology, and it is absolutely critical to offer them a standardized and seamless flow that facilitates working silicon. Cadenceâs expertise in custom design is an important addition as we build a global partner ecosystem to efficiently bring the worldâs most sophisticated chip designs to market.â
âProviding best-in-class solutions for tomorrowâs toughest design challenges, ahead of the curve, requires continuous innovation and tight collaboration with our customers and business partners,â said Lip-Bu Tan, Cadence president and CEO. âWorking closely with GLOBALFOUNDRIES helps ensure our leadership in low-power, advanced-node, and signoff technologies, and enables Cadence to provide industry-leading design technology and services to a wide range of designers seeking new avenues to market.â
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- Cadence, GlobalFoundries, Hoerzentrum Oldenburg and Leibniz University Hannover Collaborate to Advance Hearing Aid Technology
- GlobalFoundries Reports Fourth Quarter and Fiscal Year 2021 Financial Results
- Microsoft Executive Bobby Yerramilli-Rao Joins GlobalFoundries Board of Directors
- GlobalFoundries Announces Next Generation in Silicon Photonics Solutions and Collaborates with Industry Leaders to Advance a New Era of More in the Data Center
Latest News
- Perceptia Begins Port of pPLL03 to Samsung 14nm Process Technology
- Spectral Design and Test Inc. and BAE Systems Announce Collaboration in RHBD Memory IP Development
- VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications