Cadence CEO laments loss of VC in semis
SylvieBarak, EETimes
10/26/2011 2:24 PM EDT
SANTA CLARA, Calif.--Collaboration and more semiconductor VC investment is what’s needed to continue innovation in the hi-tech space, said Lip-Bu Tan, president and chief executive officer of Cadence Design Systems Inc., in a fireside chat with ARM’s executive vice Simon Seagers at TechCon.
With new technologies driving relationships between companies up and down the ecosystem, Tan--a longtime venture capitalist who remains chairman of Walden International, the VC fund he founded in 1989--agreed that collaboration had become an essential ingredient to product innovation, from startups to larger, more established companies.
To read the full article, click here
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Cadence to Acquire Hexagon’s Design & Engineering Business, Accelerating Expansion in Physical AI and System Design and Analysis
- IBM VC calls for 'open' hardware
- Doubts remain about Chartered Semi's recovery
Latest News
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool
- SkyWater Technology and Silicon Quantum Computing Team to Advance Hybrid Quantum-Classical Computing
- Dnotitia Revolutionizes AI Storage at SC25: New VDPU Accelerator Delivers Up to 9x Performance Boost