Cadence CEO laments loss of VC in semis
SylvieBarak, EETimes
10/26/2011 2:24 PM EDT
SANTA CLARA, Calif.--Collaboration and more semiconductor VC investment is what’s needed to continue innovation in the hi-tech space, said Lip-Bu Tan, president and chief executive officer of Cadence Design Systems Inc., in a fireside chat with ARM’s executive vice Simon Seagers at TechCon.
With new technologies driving relationships between companies up and down the ecosystem, Tan--a longtime venture capitalist who remains chairman of Walden International, the VC fund he founded in 1989--agreed that collaboration had become an essential ingredient to product innovation, from startups to larger, more established companies.
To read the full article, click here
Related Semiconductor IP
- NPU IP Core for Mobile
- NPU IP Core for Edge
- Specialized Video Processing NPU IP
- HYPERBUS™ Memory Controller
- AV1 Video Encoder IP
Related News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
- IBM VC calls for 'open' hardware
- Doubts remain about Chartered Semi's recovery
Latest News
- Andes Technology Announces AndeSight™ IDE v5.4 to Streamline AI and Embedded Software Development on RISC-V
- Jim Keller: ‘Whatever Nvidia Does, We’ll Do The Opposite’
- FlexGen Streamlines NoC Design as AI Demands Grow
- IntoPIX Presents Its New Titanium Software Suite: Empowering AV-Over-IP Workflows With Speed, Quality & Interoperability
- Global Semiconductor Sales Increase 2.5% Month-to-Month in April