BaySand to Initiate a Unique Low Cost Multi Project Wafer (MPW) Program That Redefines the Silicon Shuttle Concept
BaySand’s ASIC UltraShuttle-65 to Facilitate Access to Deep Sub Micron Silicon by Offering an Affordable and Reliable ASIC Solution
SAN JOSE, CA – July 25, 2016 – BaySand, the leader in application configurable ASICs, announces the availability of the ASIC UltraShuttle-65, first of its class silicon MPW program that will support multiple designs customizable by 4 metal layers. With the support of a proven design flow and methodology, the ASIC UltraShuttle-65 MPW delivers high quality verified and fully tested ASICs. The methodology is based on BaySand’s standard cell library, including logic cells, IOs, Memories and IP blocks, which are fully characterized and silicon proven, combined with BaySand’s RTL signoff design methodology that includes Design for Testability (DFT), Automatic Test Pattern Generation (ATPG), full scan, JTAG, BIST and physical implementation. BaySand is committed to deliver fully tested and verified engineering samples.
“We are excited to introduce this innovative program that will provide access to deep submicron affordable and risk free ASIC,” said Salah Werfelli, BaySand’s president and CEO. “The ASIC UltraShuttle-65 methodology delivers high quality production ready devices that shorten the Time to Market (TTM) significantly and will be changing the market dynamics.”
Compared to the traditional shuttle offered by foundries today, BaySand will customizing the logic and IOs with 4 metal layers while the bottom layers are pre-defined. BaySand will be providing the following advantages compared to traditional shuttle services:
BaySand ASIC UltraShuttle-65 | Traditional foundry shuttle service |
RTL hand off and sign off | GDS hand off |
Customer does not need special tools, licenses, or EDA tools expertise | EDA tools and EDA tools expertise required |
BaySand ASIC proven methodology | Customer own methodology |
Available IP: PLL, Memory, IOs and logic cells | Basic cell library |
Production ready tape out | NA |
DFT, ATPG and BIST included | NA |
Deliver fully tested packaged parts | Deliver none tested dies |
Schedule 6-8 weeks from tape out | Schedule about 9-12 weeks from tape out |
High volume support | NA |
The ASIC UltraShuttle-65 can also be used for FPGA to ASIC conversion and by that reducing the risk and shortening the TTM. The new program which will enable system designers to have a full ASIC implementation at low NRE cost rather than having to ship a low performance, high power implementation which cost up to 10 times higher.
Orders for the October 2016 UltraShuttle-65 can be placed today. The Shuttle is for the FG65L-5 device, which is a 65nm technology up to 600,000 usable gates, up to 900kbit of memory, 4 PLLs/DCMs with maximum of 242 user IOs. The shuttle deliver is planned for December 2017. The NRE cost, which include 100 fully tested units, is $70k, where it will cost $50k for the first 100 customers who sign up and make the commitment until the end of August. For more shuttle information, or to reserve your spot contact us at info@baysand.com.
About BaySand Incorporated
BaySand is the leader in Application Configurable ASICs targeting short time to market and cost effective ASIC solutions. With its unique and patented Metal Configurable Standard Cell (MCSC) technology and Field Configurable DSP architecture (fcDSP), the company provides ASIC designers with world class solutions featuring:
- Low NRE
- Short time to market
- Lowest Power
- Low unit cost
- Best performance
- Programmability and flexibility
BaySand is fabless, privately held and based in the Silicon Valley, San Jose CA.
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related News
- SkyWater Launches Direct Multi Project Wafer (MPW) FastShuttle Program, Expanding Capabilities to Meet Growing Customer Momentum
- EnSilica teams with BaySand to provide ASIC UltraShuttle-65 multi-project wafer customers with configurable IP solutions
- Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration
- Global UniChip became TSMC MPW Service Partner Providing 0.25 um Logic Process MPW Service for worldwide customers
Latest News
- Will RISC-V reduce auto MCU’s future risk?
- Frontgrade Gaisler Launches New GRAIN Line and Wins SNSA Contract to Commercialize First Energy-Efficient Neuromorphic AI for Space Applications
- Continuous-Variable Quantum Key Distribution (CV-QKD) system demonstration
- Latest intoPIX JPEG XS Codec Powers FOR-A’s FA-1616 for Efficient IP Production at NAB 2025
- VeriSilicon Launches ISP9000: The Next-Generation AI-Embedded ISP for Intelligent Vision Applications