ARM, TSMC lead Intel in SoC, says CEO East
Peter Clarke, EETimes
7/26/2012 7:44 AM EDT
LONDON – ARM CEO Warren East is not concerned that Intel Corp. is developing a lead in process technology of the foundries that ARM licensees usually deal with. This is despite the fact that FinFET technology for ARM processors may not be in volume production until the second-half of 2015, according to foundry Taiwan Semiconductor Manufacturing Co. Ltd.
The use of FinFETs, where transistors stick up above the surface, is considered to improve the performance of transistors and reduce leakage current in the off-state. Intel is already manufacturing in volume using in a 22-nm FinFET CMOS process while TSMC is attempting to ramp up planar 28-nm CMOS for is customers.
To read the full article, click here
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- 2025 TSMC OIP Ecosystem Forum Highlights Aion Silicon’s Leadership in Advanced SoC Design
- Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
- Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
- M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs