Alphawave Semi - Q4 2023 Trading and Business Update
LONDON, United Kingdom and TORONTO, Ontario, Canada -- January 22, 2024 – Alphawave IP Group plc (LN: AWE, the “Company” or “Alphawave Semi”), a global leader in high-speed connectivity for the world’s technology infrastructure, is pleased to publish its trading and business update for the three months ended 31 December 2023.
Highlights
- Record quarterly bookings of US$128.7m
- Record quarterly licence and NRE bookings of US$121.1m up 245% over Q4 2022
- Approximately 90% of licence & NRE bookings in advanced nodes, 7nm and below
- Major extension of IP development and licencing deal with leading APAC customer
including UCIe, PCIeGen7, 224G and 2nm technology - 3nm HPC1 chiplet-based custom silicon design win for a leading European HPC supplier
- 7 new design wins, mainly in APAC, Europe and North America
- Partnership with ARM expands addressable market
- Strong pipeline of opportunities in Q1 2024 and FY 2024
- Management remains confident in the outlook for the business
To read the full article, click here
Related Semiconductor IP
- Multi-channel, multi-rate Ethernet aggregator - 10G to 400G AX (e.g., AI)
- Multi-channel, multi-rate Ethernet aggregator - 10G to 800G DX
- 200G/400G/800G Ethernet PCS/FEC
- 50G/100G MAC/PCS/FEC
- 25G/10G/SGMII/ 1000BASE-X PCS and MAC
Related News
- Alphawave Semi: Interim results for the six months ended 30 June 2023
- Alphawave Semi: FY 2023 and 2024 YTD Trading Update and Notice of Results
- Alphawave Semi Audited Results for the Year Ended 31 December 2023
- Alphawave Semi has published its audited results for the year ended 31 December 2022
Latest News
- How CXL 3.1 and PCIe 6.2 are Redefining Compute Efficiency
- Secure-IC at Computex 2025: Enabling Trust in AI, Chiplets, and Quantum-Ready Systems
- Automotive Industry Charts New Course with RISC-V
- Xiphera Partners with Siemens Cre8Ventures to Strengthen Automotive Security and Support EU Chips Act Sovereignty Goals
- NY CREATES and Fraunhofer Institute Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale