Agilent Technologies has licensed 3DSP's family of DSP cores
DSP licences
By David Larner, Embedded Systems
September 26, 2001 (9:13 a.m. EST)
URL: http://www.eetimes.com/story/OEG20010926S0018
Agilent Technologies has licensed 3DSP's family of DSP cores for use in developing next-generation system-on-chip (SOC) products for wireless phones, personal digital assistants and other advanced communications and mobile appliance applications. Agilent will get access to the SP-3, SP-5 and SP-5flex cores and the DSP-Shuttle intelligent bus controller.
Related Semiconductor IP
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
- MIPI CSI-2 CSE2 Security Module
- ASIL B Compliant MIPI CSI-2 CSE2 Security Module
Related News
- Chips&Media has licensed its VP9 and HEVC multi decoder IP to Nexell and other 5 chip manufacturers
- Titan IC has licensed its RegEx Processor to Silicom Ltd for advanced FPGA SmartNIC platforms
- NSITEXE DR1000C, a RISC-V based parallel processor IP with vector extension (DFP: Data Flow Processor) has been licensed for Renesas' new RH850/U2B Automotive MCUs
- SEGGER announces that Renesas has licensed emWin for all RX microcontrollers
Latest News
- Arasan Announces immediate availability of its UFS 5.0 Host controller IP
- Bolt Graphics Completes Tape-Out of Test Chip for Its High-Performance Zeus GPU, A Major Milestone in Reducing Computing Costs By 17x
- NEO Semiconductor Demonstrates 3D X-DRAM Proof-of-Concept, Secures Strategic Investment to Advance AI Memory
- M31 Collaborates with TSMC to Achieve Tapeout of eUSB2V2 on N2P Process, Advancing Design IP Ecosystem
- Menta’s eFPGA Technology Adopted by AIST for Cryptography and Hardware Security Programs