TI's OMAP platform powers Windows 8 tablets with advanced visual and computing capabilities
2012-01-10 08:15:00
SoC Architecture & Assembly
Semiconductor IP News Archive - Page 990 of 1947
IBM and GLOBALFOUNDRIES Begin First Production At New York's Latest Semiconductor Fab
2012-01-10 08:08:00
Foundries & Process Nodes
Marvell and Tuxera Announce Industry's Fastest Full-Featured NAS Solution
2012-01-10 02:23:00
SoC Architecture & Assembly
Multimedia and connectivity technologies transforming much wider markets than just smartphones, says Imagination
2012-01-10 01:18:00
Misc
Cryptography Research and CPU Tech Sign Patent License Agreement for DPA Countermeasures
2012-01-09 23:47:00
Commercial Deals
NXP Semiconductors Comments on Impact of Trident Microsystems Chapter 11 Filing Announces Conference Call to Review Fourth Quarter 2011 Financial Results
2012-01-09 16:27:00
Strategic Partnerships
SENSIO licenses its SENSIO Hi-Fi 3D decoding technology for 3DTV chips
2012-01-09 15:57:00
Commercial Deals
Memoir Systems Selects ChipStart as Global Sales Representative Company
2012-01-09 15:54:00
Strategic Partnerships
Cadence Expands Proven NAND Flash Design IP Offering With ONFI 3 PHY and Controller
2012-01-09 14:17:00
IP Cores & Design
Why the semiconductor industry will rise again
2012-01-09 13:29:00
Analysis & Insight
MIPS Technologies Teams with Leading Providers of Multimedia and Gaming Solutions to Enable Multi-screen Consumer Experience
2012-01-09 12:48:00
SoC Architecture & Assembly
IP-Maker to deliver the first IP core compliant to the NVM Express specification
2012-01-09 11:04:00
IP Cores & Design
Chips&Media to Exhibit its latest Video IP at CES 2012
2012-01-09 10:09:00
Misc
Enverv uses Cosmic Circuits ultra low-jitter PLL
2012-01-09 09:47:00
Commercial Deals
MIPS Technologies Teams with Gameloft to Bring Popular HD Games to MIPS-Based Android Tablets
2012-01-09 09:44:00
SoC Architecture & Assembly
Tensilica's HiFi 3 DSP IP Core Provides Over 1.5x Better Performance for Audio Post Processing and Voice in Smartphones and Home Entertainment
2012-01-09 08:59:00
IP Cores & Design
HomePlug Powerline Alliance Announces AV2 Specification for Next-Generation Broadband Speeds over Powerline Wires
2012-01-09 08:42:00
Misc
Toshiba Introduces Super Speed USB 3.0-Compliant USB Flash Memory
2012-01-09 08:12:00
SoC Architecture & Assembly
UMC Reports Sales for December 2011
2012-01-09 07:41:00
Foundries & Process Nodes
Microdul Adopts Advanced Mixed-signal Solution from DOLPHIN Integration and Tanner EDA and Leads Regional User Group to Drive Continued Innovation
2012-01-09 04:33:00
EDA & Design Tools