Allegro DVT showcases the first HEVC video hardware decoder IP at CES 2013 2013-01-03 17:24:00 IP Cores & Design
Sony and InterDigital Team to Launch Machine-to-Machine Focused Joint Venture Called Convida Wireless 2013-01-03 17:17:00 Strategic Partnerships
Tensilica Introduces the Smallest, Lowest Power DSP IP Core For Always-Listening Voice Trigger and Voice Recognition 2013-01-03 17:04:00 IP Cores & Design
CEVA Introduces Comprehensive Computer Vision Library Optimized for CEVA-MM3101 Imaging & Vision Platform 2013-01-03 11:09:00 SoC Architecture & Assembly
InterDigital and Research In Motion Extend Patent License and Include 4G 2013-01-02 15:23:00 Commercial Deals
Eclipse IDE now available for users of IAR Embedded Workbench for ARM 2013-01-02 09:29:00 SoC Architecture & Assembly
Qualchip Passed the Acceptance Inspection of CEC Specialist Group under Teledyne LeCroy's Test Platform's Verification 2012-12-28 11:13:00 SoC Architecture & Assembly
NSCore is Expanding its US Sales and Marketing Channel by Partnering with DSM Silicon Solutions 2012-12-28 09:49:00 Strategic Partnerships
Huawei Names Altera 2012 Excellent Core Partner for Delivering Quality, Leading-edge Products and Superior Technical Support 2012-12-28 08:35:00 Misc
Samsung and Synopsys Collaborate to Achieve First 14-nanometer FinFET Tapeout 2012-12-21 12:07:00 EDA & Design Tools
ARM and Cadence Tape Out First 14nm FinFET Test Chip Targeting Samsung Process 2012-12-21 12:05:00 IP Cores & Design
IDT and PLX Technology Announce Termination of Proposed Transaction and IDT Withdraws Exchange Offer for PLX Technology Shares 2012-12-20 15:29:00 Strategic Partnerships
SMIC Achieves Breakthrough in Backside-Illuminated Image Sensors 2012-12-20 14:45:00 Foundries & Process Nodes
Xilinx Vivado Design Suite Now Available in WebPACK Edition 2012-12-20 09:40:00 SoC Architecture & Assembly