Cadence Introduces Spectre XPS, A New FastSPICE Simulator Delivering Up To 10X Faster Throughput 2013-10-09 15:02:00 EDA & Design Tools
Imperas Provides Comprehensive ARM TrustZone Modeling Kit For OVP-Based Virtual Platforms 2013-10-09 07:57:00 SoC Architecture & Assembly
Alizem signs with the Canadian Space Agency to offer new embedded Motor Control Software IP 2013-10-09 07:23:00 Strategic Partnerships
Bank Card IC Products Adopting SMIC eEEPROM Platform Certified by China Union Pay 2013-10-08 17:59:00 Foundries & Process Nodes
New Xilinx Virtex-7 FPGA VC709 Connectivity Kit Accelerates Design Productivity for High-Bandwidth Applications 2013-10-08 17:50:00 Misc
Avery Design Systems Announces UFS Host Controller UFSHCI Verification Solution 2013-10-08 16:47:00 Verification IP
Mediatek Extends Partnership with ARM to Drive Next-Generation Mobile and Consumer Technology 2013-10-08 16:28:00 Commercial Deals
EnSilica and Kili Technology collaboration delivers FIPS-compliant secure processor IC 2013-10-08 10:38:00 Commercial Deals
Imagination and Rightware enter multi-year strategic partnership 2013-10-07 16:07:00 SoC Architecture & Assembly
Arasan Chip Systems Announces Industry First M-PHY 3.0 Total IP Solution 2013-10-07 15:50:00 IP Cores & Design
Vivante Unveils Less than 1 mm2 OpenGL ES 2.0 GPU for Wearables and Internet of Things (IoT) Devices 2013-10-07 15:39:00 IP Cores & Design
Altera Supports China Mobile Research Institute in Developing Next-Generation Wireless Networks 2013-10-07 15:17:00 SoC Architecture & Assembly
Digital Core Design Announces SPI master slave enhanced with detectors 2013-10-07 13:23:00 IP Cores & Design
Global Semiconductor Sales Increase for Sixth Straight Month in August 2013-10-04 15:15:00 Analysis & Insight
SMIC IP R&D Center Applies EDA Solution of Beijing Empyrean 2013-10-04 13:10:00 Foundries & Process Nodes