Microsemi and Mercury Systems Announce Scheduled Closing for Microsemi's Sale of its Embedded Security, RF and Microwave, and Custom Microelectronics Businesses to Mercury
2016-04-28 15:15:00
Business
Recent News
Xilinx Announces Fourth Quarter & Fiscal 2016 Results; Record 28nm & 20nm Sales, Dividend Raised For 11th Consecutive Year
2016-04-28 10:56:00
Financial
UMC Reports First Quarter 2016 Results
2016-04-28 10:40:00
Financial
Pleora Brings High-Performance Imaging Expertise to NBASE-T Alliance
2016-04-27 17:14:00
Other
UMC: Business to Bounce Back This Year
2016-04-27 15:54:00
Commentary / Analysis
Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset
2016-04-27 13:18:00
Deals
Apple Drove Entire Foundry Sales Increase at TSMC in 2015
2016-04-27 13:16:00
Commentary / Analysis
RFEL launches new Fractional Rate Resampler IP core
2016-04-26 16:42:00
IP
Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT and Automotive Applications
2016-04-26 15:11:00
IP
GCT Semiconductor Licenses Arteris FlexNoC Interconnect IP for LTE Digital Baseband Systems-on-Chip (SoCs)
2016-04-26 14:58:00
Deals
ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers
2016-04-26 11:54:00
EDA
Cadence Reports First Quarter 2016 Financial Results
2016-04-26 09:06:00
Financial
China's Chip Patent Growth May Be Short Lived
2016-04-25 17:10:00
Commentary / Analysis
Samsung Details Foundry Roadmap
2016-04-25 15:45:00
Commentary / Analysis
AMD Licenses x86 To China
2016-04-25 14:55:00
Commentary / Analysis
Low-power of Bluetooth SoCs depends on Dolphin Integration's oscillators
2016-04-25 13:53:00
IP
North American Semiconductor Equipment Industry Posts March 2016 Book-to-Bill Ratio of 1.15
2016-04-25 05:51:00
Commentary / Analysis
MPEG LA Expands DisplayPort License Coverage
2016-04-25 04:16:00
Legal
Toshiba Adopts Cadence Innovus Implementation System for Production Mobile Memory Controller Design
2016-04-25 04:08:00
EDA
Qualcomm Signs 3G/4G Chinese Patent License Agreement with Hisense
2016-04-25 03:55:00
Legal
Xilinx Announces Fourth Quarter & Fiscal 2016 Results; Record 28nm & 20nm Sales, Dividend Raised For 11th Consecutive Year
2016-04-28 10:56:00
Financial
UMC Reports First Quarter 2016 Results
2016-04-28 10:40:00
Financial
Pleora Brings High-Performance Imaging Expertise to NBASE-T Alliance
2016-04-27 17:14:00
Other
UMC: Business to Bounce Back This Year
2016-04-27 15:54:00
Commentary / Analysis
Autotalks License and Deploy CEVA DSP for Mass-Market V2X Chipset
2016-04-27 13:18:00
Deals
Apple Drove Entire Foundry Sales Increase at TSMC in 2015
2016-04-27 13:16:00
Commentary / Analysis
RFEL launches new Fractional Rate Resampler IP core
2016-04-26 16:42:00
IP
Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT and Automotive Applications
2016-04-26 15:11:00
IP
GCT Semiconductor Licenses Arteris FlexNoC Interconnect IP for LTE Digital Baseband Systems-on-Chip (SoCs)
2016-04-26 14:58:00
Deals
ANSYS Simulation Solutions Bolster ARM Energy-Efficient IP For Internet of Things and Cloud Servers
2016-04-26 11:54:00
EDA
Cadence Reports First Quarter 2016 Financial Results
2016-04-26 09:06:00
Financial
China's Chip Patent Growth May Be Short Lived
2016-04-25 17:10:00
Commentary / Analysis
Samsung Details Foundry Roadmap
2016-04-25 15:45:00
Commentary / Analysis
AMD Licenses x86 To China
2016-04-25 14:55:00
Commentary / Analysis
Low-power of Bluetooth SoCs depends on Dolphin Integration's oscillators
2016-04-25 13:53:00
IP
North American Semiconductor Equipment Industry Posts March 2016 Book-to-Bill Ratio of 1.15
2016-04-25 05:51:00
Commentary / Analysis
MPEG LA Expands DisplayPort License Coverage
2016-04-25 04:16:00
Legal
Toshiba Adopts Cadence Innovus Implementation System for Production Mobile Memory Controller Design
2016-04-25 04:08:00
EDA
Qualcomm Signs 3G/4G Chinese Patent License Agreement with Hisense
2016-04-25 03:55:00
Legal