Synopsys' DesignWare Audio IP Achieves First-Pass Silicon Success in Leading 65-nm and 55-nm Process Technologies 2011-10-26 15:05:00 IP Cores & Design
Xilinx and Cadence Introduce an Extensible Virtual Platform to Enable Software-Centric Approach for Embedded Software Developers 2011-10-26 13:11:00 EDA & Design Tools
Freescale reveals new product platform that integrates ARM(R) Cortex(TM)-M4 and Cortex(TM)-A5 cores 2011-10-26 07:56:00 SoC Architecture & Assembly
RAD3 Communications, Inc. Announces Intent to be Acquired by PMC-Sierra 2011-10-26 07:05:00 Strategic Partnerships
ARM Cortex-A9 MPCore Fast Processor Models Provided by Imperas and OVP 2011-10-26 06:51:00 EDA & Design Tools
Samsung and Cadence Announce Production of Breakthrough 32nm HD Digital Camera SoC for Ambarella 2011-10-26 01:50:00 EDA & Design Tools
Mentor Graphics Delivers Emulation Solutions for the Verification of USB SuperSpeed (3.0) Products 2011-10-25 15:24:00 Misc
Xilinx Ships World's Highest Capacity FPGA and Shatters Industry Record for Number of Transistors by 2X 2011-10-25 14:50:00 SoC Architecture & Assembly
VIA Telecom Selects Arteris C2C High-Speed Inter-Chip Communications IP 2011-10-25 14:38:00 Commercial Deals
ARM Holdings Plc Reports Results For The Third Quarter And Nine Months Ended 30 September 2011 2011-10-25 14:03:00 Financials
EnSilica launches version 2.5 of its eSi-RISC Development Suite 2011-10-25 11:02:00 SoC Architecture & Assembly
Imagination launches HelloSoft 4G VoLTE platform and SDK 2011-10-25 10:45:00 SoC Architecture & Assembly
Triad Semiconductor Introduces Three New Configurable High Voltage Mixed Signal ASICs 2011-10-25 09:45:00 SoC Architecture & Assembly
eSilicon Selects Synopsys' Custom IC Design Solution and Tapes Out 28-nm Designs 2011-10-25 08:43:00 EDA & Design Tools
Tablet PC Architectures Dominated by ARM and iOS; New Kindle Could Light a Fire Under Android 2011-10-25 08:01:00 Analysis & Insight
EnVerv Selects Tensilica for Smart Grid Power Line Communications 2011-10-25 07:29:00 Commercial Deals