NXP Introduces Advanced 3DTV Processor
PNX5130 is industryâs first single-chip solution for 3DTV, FRC (MEMC) and local dimming
Eindhoven, Netherlands, December 14, 2009 â.NXP Semiconductors today announced the availability of the PNX5130, the industryâs first video co-processor enabling 3DTV, frame-rate conversion (FRC) and local backlight dimming in a single chip. By eliminating the need for external FPGA devices to support 3DTV, NXP is providing a highly cost-effective post-processing solution that will enable manufacturers to bring competitively priced 3D-enabled TV sets to the mainstream consumer market. The PNX5130 enables conversion of all popular 3DTV formats to both line and frame interleaved displays, and is designed for maximum flexibility to support emerging 3DTV standards. The PNX5130 is available immediately and will be demonstrated at 2010 CES in Las Vegas, Nevada, USA.
â3DTV is the new product differentiator for home entertainment systems,â said Vincent Vermeer, product marketing director for digital TV systems, NXP Semiconductors. âWith the growing popularity of 3D movies, we expect to see a much wider range of 3D content â including broadcast content and games â become available for TV viewers over the next two years. The challenge for TV manufacturers will be how to make the 3D viewing experience more affordable for the average consumer. The PNX5130 is a critical part of the solution â combining support for 3DTV, FRC and local LED backlight dimming in a single integrated chip, reducing the total bill of materials.â
Flexible Architecture for 3DTV
Although 3DTV is still in the early stages of standardization, the flexible architecture of the PNX5130 supports the most popular formats for encoding â including spatial 3D, temporal 3D and 3D with depth â as well as display.
The PNX5130 is able to drive two different types of 3DTV display technologies used today: frame interleave, which it can support at 240Hz, as well as line interleave. In frame interleaved displays, images for the left and right eye are presented sequentially, and require the use of shutter glasses which are synchronized with the alternating frames. In line interleaved displays, passive polarizer glasses are used to filter between odd and even lines, which present different images for the left and right eyes. In addition, the PNX5130 can also generate depth to 2D video or adjust depth to stereoscopic content.
Motion Accurate Picture Processing (MAPP)The high-performance PNX5130 video post-processing platform also enables 3DTV with movie judder compensation. Based on the architecture of the PNX5100 platform, which has been widely recognized for its outstanding support of MEMC (Motion Estimation, Motion Compensation), the PNX5130 features the next generation of NXPâs proprietary MAPP (Motion Accurate Picture Processing) technology, which combines movie judder cancellation, motion sharpness, and vivid color management in a single device.
Technical Information
Key features of the highly integrated PNX5130 video co-processor include:
- 3DTV algorithms and format converters enabling conversion of all popular 3DTV formats to line interleaved (60/120Hz) and frame interleaved (120/240Hz) displays
- Superior motion sharpness technology and full motion compensated up-conversion (ME/MC) to 1920 x 1080p at 120Hz and 240Hz
- HD halo-reduced movie judder compensation and motion blur reduction
- Integrated local dimming feature for combined local dimming and MEMC applications
- Wide color gamut mapping; skin tone protection; green, blue and white stretch; sharpness enhancements (2D peaking, LTI, CTI, CDS); and contrast enhancements
- Dynamic backlight control and 2D (local) dimming for 120Hz and 240Hz TVsIn addition, the PNX5130 will offer integrated Full Motion Estimation for 3DTV starting in Q1 2010.
Product Availability
Engineering samples of the PNX5130 are available immediately, while the final software release will be available in Q1 2010.
About NXP Semiconductors
NXP Semiconductors provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power, Digital Processing and manufacturing expertise. These innovations are used in a wide range of automotive, industrial, consumer, lighting, medical, computing and identification applications. Headquartered in Europe, the company has about 29,000 employees working in more than 30 countries and posted sales of USD 5.4 billion in 2008. News from NXP is located at www.nxp.com.
Related Semiconductor IP
- Simulation VIP for Ethernet UEC
- Bluetooth® Low Energy 6.2 PHY IP with Channel Sounding
- Simulation VIP for UALink
- General use, integer-N 4GHz Hybrid Phase Locked Loop on TSMC 28HPC
- JPEG XL Encoder
Related News
- Broadcom Delivers Nine New 40nm Set-Top Box Solutions for the Full Resolution 3DTV Internet Connected Home
- Xilinx Consumer Video Kit Drives Innovation for 3DTV and Other Digital Displays with More Bandwidth and Standards Support
- SENSIO licenses its SENSIO Hi-Fi 3D decoding technology for 3DTV chips
- CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors
Latest News
- Spectral Design and Test Inc. and BAE Systems Announce Collaboration in RHBD Memory IP Development
- VSORA and GUC Partner on Jotunn8 Datacenter AI Inference Processor
- Mixel MIPI IP Integrated into Automotive Radar Processors Supporting Safety-critical Applications
- GlobalFoundries and Navitas Semiconductor Partner to Accelerate U.S. GaN Technology and Manufacturing for AI Datacenters and Critical Power Applications
- VLSI EXPERT selects Innatera Spiking Neural Processors to build industry-led neuromorphic talent pool