Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for …
- UCIe
Lightweight die-to-die interconnect solution consisting of the Physical Layer, Die-to-Die Layer and Protocol Layer optimized for …
UCIe Die-to-Die Chiplet Controller
The UCIe Controller IP is a configurable and customizable UCIe 1.1 compliant die-to-die controller.
eFPGA IP — Flexible Reconfigurable Logic Acceleration Core
RapidFlex eFPGA IP provides a reconfigurable, upgradeable, and iterative logic computing layer for SoCs, MCUs, AI accelerators, i…
Universal Chiplet Interconnect Express (UCIe™) Controller
High-bandwidth, low-power and low-latency standardized die-to-die interconnect The Cadence UCIe™ PHY is a high-bandwidth, low-pow…