What is Via-PUF Security Chip for Root of Trust?
Via-PUF Security Chip for Root of Trust is a Root Of Trust IP core from ICTK listed on Semi IP Hub.
The vPUF® IP, powered by Via PUF (Physically Unclonable Function) technology, provides a unique silicon fingerprint for inborn id…
The vPUF® IP, powered by Via PUF (Physically Unclonable Function) technology, provides a unique silicon fingerprint for inborn identity function, essential for the Root of Trust in security applications.
Why vPUF?
Secret information, such as device keys and IDs stored in standard non volatile memory (like ROM and eFlash), are vulnerable to attacks like reverse engineering and optical analysis.
vPUF technology generates inborn secret keys on-the-fly only when needed. These self-generated keys are constantly stable under any circumstances.
Technology Background
vPUF Technology Strength
vPUF characteristics in accordance with ISO/IEC 20897-1/2
| Features | Measures | Note |
| Steadiness | No bit errors measured | No value changes have been reported for over 90 billion vPUF cells in mass production |
| Randomness | Hamming Weight near ideal value | ideal value = 5. Passed the NIST SP 800-22 and NIST SP 800-90B randomness test. |
| Uniqueness | Hamming Distance near ideal value | ideal value = 0.5 |
| Tamper-resistance | Obfuscation of vPUF bitcells | vPUF bitcells are scattered among other logic cells throughout the entire chip. |
| Physical unclonability | Physically unclonable formation | vPUF cells are generated under uncontrollable and unclonable physical variation |
vPUF architecture
Silicon Validation
Note: some files may require an NDA depending on provider policy.
Via-PUF Security Chip for Root of Trust is a Root Of Trust IP core from ICTK listed on Semi IP Hub.
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Root Of Trust IP.
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.