Vendor: Cadence Design Systems, Inc. Category: DSP Core

Tensilica Fusion F1 DSP

Smallest and lowest power DSP for narrowband wireless communications and always-on applications The Cadence® Tensilica® Fusion F1…

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Overview

Smallest and lowest power DSP for narrowband wireless communications and always-on applications

The Cadence® Tensilica® Fusion F1 DSP offers the lowest energy, small footprint, high-performance control and signal processing best fit for narrowband wireless communication, always-on, IoT, and wearables applications. The Fusion F1 DSP is very efficient in running communications standards typically associated with IoT device communications, such as Bluetooth LE, Thread, and Zigbee using IEEE 802.15.4, SmartGrid 802.15.4g, WiFi 802.11n and 802.11ah, 2G and LTE Category 0 release 12 and 13, and global navigation satellite systems (GNSS). The Fusion F1 DSP also is suitable for designs in voice trigger, voice recognition, face trigger, context-aware sensor fusion, and similar applications.

Key features

  • Certified ISO 26262:2018 ASIL-compliant
  • AES-128 acceleration
  • Viterbi for WiFi and LTE
  • Acceleration for ITU/ETSI voice codec
  • Fixed-point MAC and floating-point FMA
  • Versatile for a broad segment of IoT, wearable, and NB wireless communications designs
  • TIE for easy extension and further performance enhancement
  • Optimized libraries and application examples for easy software development

Block Diagram

Tensilica Fusion F1 DSP block diagram

Applications

  • Automotive,
  • Communications,
  • Consumer Electronics,
  • Data Processing,
  • Industrial and Medical,
  • Military/Civil Aerospace,
  • Others

Specifications

Identity

Part Number
Tensilica Fusion F1 DSP
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP

Files

Product Sheet Download

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Provider

Contact Cadence Design Systems, Inc.

Learn more about DSP Core IP core

Role of Time-of-Flight Sensors in Automotive

The automotive sector is undergoing a profound transformation, moving beyond basic detection to a comprehensive, real-time 3D understanding of both the external environment and the vehicle's interior. ToF is emerging as a pivotal technology, offering precise 3D depth and distance information essential for navigating complex environments and understanding in-cabin dynamics.

Building a high-performance, low-power audio/voice subsystem

With the growing popularity of applications such as mobile gaming and voice triggering, the audio/voice subsystem is playing a prominent role in many mobile system-on-chip (SoC) designs. The subsystem must be designed to meet dual demands: high-performance, high-resolution audio stream processing as well as always-on, low-power voice trigger and recognition. Customizable digital signal processing (DSP) and audio/voice subsystem solution intellectual property (IP) blocks can provide a cost-effective and efficient way to develop and deliver high-performance audio/voice products.

Frequently asked questions about DSP Core IP cores

What is Tensilica Fusion F1 DSP?

Tensilica Fusion F1 DSP is a DSP Core IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this DSP Core?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DSP Core IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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