Tessent AI IC debug and optimization
The multicore architectures of SoCs for machine learning (ML) and artificial intelligence (AI) applications provide unique challe…
Tessent SoC debug and optimization
Tessent Embedded Analytics accelerates debug, validation, and optimization of complex multi-core SoCs.
UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N4P, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in SS SF4X, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in SS SF2, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in Intel 18A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The Veriest SPI to AMBA AHB Master Bridge Design IP offers a simple solution to provide "backdoor" access from external SPI maste…