HBM Interface IP Cores

High Bandwidth Memory (HBM) IP encompasses the controller, PHY, and associated interface logic required to connect SoCs, AI accelerators, GPUs, and HPC processors to HBM memory stacks through advanced 2.5D and 3D packaging technologies.

HBM interfaces provide extremely high memory bandwidth through wide parallel buses, multiple independent channels, and low-power signaling. Modern implementations support HBM2E, HBM3, HBM3E, and emerging HBM4 standards, enabling memory subsystems that deliver multi-terabyte-per-second bandwidth while maintaining high energy efficiency.

This catalog includes HBM controllers, PHYs, verification IP, and subsystem solutions designed for advanced-node ASICs targeting AI training and inference, high-performance computing, networking, and data center applications. Solutions can be compared based on supported HBM generation, bandwidth, channel architecture, reliability features, packaging requirements, and foundry process compatibility.

 
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Compare 62 HBM Interface IP Cores from 13 vendors

  • TSMC CLN5FF HBM PHY IP

    Global UniChip Corp. (GUC)
    HQ: Taiwan

    This datasheet describes GUC HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide …

    • Controller + PHY + 1
    • TSMC
    • 5nm
    • N5FF
    • Silicon Proven
    Part #: IGAHBMY02A Maturity: Production
  • TSMC CLN16FFGL+ HBM PHY IP

    Global UniChip Corp. (GUC)
    HQ: Taiwan

    This datasheet describes GUC’s HBM (High Bandwidth Memory) PHY IP, which can be integrated with HBM memory controller to provide …

    • Controller + PHY + 1
    • TSMC
    • 16nm
    • Silicon Proven
    Part #: IGAHBMV02A Maturity: Production
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