Vendor: T2M GmbH Category: Audio Codec

LC3 Codec IP for Kalimba DSP

Bluetooth LE Audio introduces an all-new Bluetooth audio codec called LC3 (Low Complexity Communication Codec)., to deliver high-…

Overview

Bluetooth LE Audio introduces an all-new Bluetooth audio codec called LC3 (Low Complexity Communication Codec)., to deliver high-quality speech and audio streaming, at low data rates, lower power and lower bandwidth Bluetooth LE radio, overcoming essential shortcomings in today’s wireless communication platforms.
This LC3 Codec reference design is developed for the popular Kalimba DSP used in the premium tier single-chip solutions optimized for TWS earbuds, smart speakers, wearables, wireless headphones, Bluetooth enabled hearing aids and automotive infotainment units.

Key features

  • LC3 Codec IP for Bluetooth LE Audio
  • Turnkey TWS Bluetooth Audio platform
  • RivieraWaves Bluetooth 5.2 dual mode Baseband Controller
  • RivieraWaves Bluetooth 5.2 Low Energy Baseband Controller, software and profiles
  • RivieraWaves Bluetooth 5.3 Low Energy Baseband Controller, software and profiles
  • RivieraWaves Bluetooth 5.3 dual mode Baseband Controller

Block Diagram

LC3 Codec for Kalimba DSP block diagram

Specifications

Identity

Part Number
LC3 Codec for Kalimba DSP
Vendor
T2M GmbH
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

T2M GmbH
HQ: Germany

Learn more about Audio Codec IP core

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Frequently asked questions about Audio Codec IP cores

What is LC3 Codec IP for Kalimba DSP?

LC3 Codec IP for Kalimba DSP is a Audio Codec IP core from T2M GmbH listed on Semi IP Hub.

How should engineers evaluate this Audio Codec?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Audio Codec IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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