Vendor: Fraunhofer IPMS Category: DC/DC Converter

Energy Harvesting module with AC-DC converter for X-FAB 180nm

Fraunhofer IPMS offers an energy harvesting module with integrated AC-DC converter and voltage limitation.

X-FAB 180nm XT018 Available on request View all specifications

Overview

Fraunhofer IPMS offers an energy harvesting module with integrated AC-DC converter and voltage limitation. Energy can be harvested from piezoelectric sources. Frequency input is from 10Hz to 10kHz. The energy conversion rate is up to 65%. The output voltage is up to 5V dependent on load.

Key features

  • Silicon proven in X-FAB XT018 FD-SOI
  • Input frequency: 10Hz to 10kHz
  • Power conversion rate: up to 65%
  • Output voltage (DC): up to 5V
  • No external components

Block Diagram

Benefits

  • Battery-free IoT devices
  • Wireless sensor modules
  • Sensor modules with long lifetime
  • No maintenance

Applications

  • IoT devices
  • Wireless modules
  • Sensor modules

What’s Included?

  • Datasheet & integration guide
  • HDL model
  • GDSII layout
  • Customer support

Silicon Options

Foundry Node Process Maturity
X-FAB 180nm XT018 Available on request

Specifications

Identity

Part Number
IPMS-EMIC
Vendor
Fraunhofer IPMS
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

HQ: Germany

Learn more about DC/DC Converter IP core

Frequently asked questions about DC-DC Converter IP cores

What is Energy Harvesting module with AC-DC converter for X-FAB 180nm?

Energy Harvesting module with AC-DC converter for X-FAB 180nm is a DC/DC Converter IP core from Fraunhofer IPMS listed on Semi IP Hub. It is listed with support for x-fab Available on request.

How should engineers evaluate this DC/DC Converter?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DC/DC Converter IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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