Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
The demand for high performance computing, next-gen servers, and AI accelerators is growing rapidly, increasing the need for faster data processing with expanding workloads.
Vendor:
Analog Bits Inc.
Category:
3DIO
Chip-to-Chip IO Buffer on TSMC CLN4P
The Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra- short reach environments, usi…
Overview
The Chip-to-Chip IO Buffer is a general purpose IO for medium-speed per lane transactions in ultra- short reach environments, using single-ended switching for efficient high-density utilization of available inter- chip routing tracks. It features core-voltage-level signal switching for low power and high voltage margin, and an unterminated receiver allowing for maximum signal swing at lowest power in ultra-short reach environments.
The output is tristateable allowing for bi-directional signal flow.
The output driver is implemented in Analog Bits’ proprietary architecture that uses core devices only.
Chip-to-Chip IO Buffer Characteristics Description Symbol Min Typ Max Units I/O Bit Rate FCLK 0 1000 Mb/s DC Output Drive (high @ VDD/2) IOH 12.5 mA DC Output Drive (low @ VDD/2) IOL 12.5 mA Capacitance of the PAD pin CPIN 1.5 pF Maximum Load @1000Mbps CL 1.5 pF TX Mode Power @800Mbps at runlength=2 P 0.65 mW RX Mode Power @800Mbps at runlength=2 P 0.07 mW Hysteresis (when enabled) 5 10 % of VDD Operational Voltage (Core supply) VDD 0.65 0.725 0.825 V Operational Voltage (IO supply) VDDA 0.65 0.725 0.825 V Operational Temperature TOP -40 25 125 C Total area of macro A 0.0018 sq.mm Dimensions: 32um (X) by 55.52um (Y) Table 1: Operational Specifications
Key features
- Single-Ended CMOS IO
- DC to 1Gb/s operation
- Core voltage CMOS signaling
- Low power consumption
- Built-in ESD protection
- Requires no additional on-chip components or band-gaps, minimizing power consumption
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 4nm | N4P | Available on request |
Specifications
Identity
Part Number
Chip-to-Chip IO Buffer on TSMC CLN4P
Vendor
Analog Bits Inc.
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
USA
Learn more about 3DIO IP core
Frequently asked questions about 3DIO Pad Library IP cores
What is Chip-to-Chip IO Buffer on TSMC CLN4P?
Chip-to-Chip IO Buffer on TSMC CLN4P is a 3DIO IP core from Analog Bits Inc. listed on Semi IP Hub. It is listed with support for tsmc Available on request.
How should engineers evaluate this 3DIO?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this 3DIO IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.