Overview
The Silicon chip supports BT EDR 1Mbps, 2Mbps, 3Mbps support combines the features and functions needed for all BT Audio solutions. It supports standards and industrial alliance specifications including BLE Mesh, Zigbee, RF4CE, HomeKit, 6LoWPAN, Thread, ANT standard.
The chip integrates strong 32-bit MCU, with DSP FPU and supports 128K sram with 512K - 4MB flash encryption.
It has 16bit/ 16 Khz ADC/DAC with embedded codec, and Audip processing algorithms such as - Noise suppression, Echo cancellation and equalisation features.
It has SPI, USB 2.0, I2C, UART, I2S interface with 32 GPIOs.
This is available as the white label chip or any custom modification as per your requirement.
Learn more about Bluetooth IP core
The adoption of the Bluetooth low energy (Bluetooth LE) specifications v4.0/v4.2 standards is being driven by adoption in several markets such as the Health and Fitness devices, Beacons, Asset tracking, Home automation, PC Peripherals etc. Bluetooth low energy 5, together with the Bluetooth LE Mesh specifications are set to make Bluetooth the ‘Connectivity of Choice’ in IoT markets such as Connected Home, Commercial Lighting and Industrial Wireless Sensor Network markets.
Wireless audio (wireless earbuds, headphones and speakers) introduced us to a completely new level of listening convenience and freedom, prompting the rapid growth we are already seeing in this consumer segment (30% CAGR for wireless earbuds and 14% for wireless headphones). Now the race is on to further improve audio quality and capability in these devices.
Franz Dugand, Ceva
Navot Goren, Ceva
Laura Moore
Synopsys is now shipping support for Bluetooth® 5.4, the latest specification from the Bluetooth SIG (Special Interest Group). The enhancements in Bluetooth 5.4 will open additional markets and use cases. This is one of the many inflection points in the Bluetooth Low Energy market that will be discussed in this paper.
